News Releases from TopLine Dummy Components
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6 news releases added by TopLine Dummy Components
Company Information:
TopLine IMAPS Presentation Free Download
Oct 30, 2023 | Martin Hart announces that his recent ground-breaking paper and presentation, titled "Next Generation Solder Columns Extend Life for Large Packages for Space Applications and Data Centers", is available on the TopLine web site and is available for free download. It was presented by Hart at IMAPS 2023 in San Diego, California recently.
TopLine Offers Bonding Wire, CCGA, Solutions at Productronica 2023
Oct 23, 2023 | TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Dr. Jeffrey Sokol, Senior Engineering Specialist, Joins TopLine®
Jun 23, 2021 | Dr. Jeffrey Sokol has joined TopLine Corporation to provide guidance in matters involving aerospace and defense to C-level management, it is announced today. Dr. Sokol's background as a Senior Engineering specialist in hybrid microcircuits, radiation effects, and system survivability contributes to TopLine's growth plans.
TopLine® Awarded US Patent for CCGA Lead Free Solder Columns
Apr 01, 2021 | TopLine Corporation has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.
TopLine® Exhibiting in 58th annual NSREC IEEE Conference
Nov 17, 2020 | TopLine Corporation will exhibit in the 58th annual IEEE Nuclear and Space Radiation Effects Conference (NSREC), which will have its first Virtual Conference and Exhibition beginning November 29 and accessible through December 30. Live virtual Exhibits will be accessible December 1-8.
TopLine Sponsors IMAPS Wire Bonding Conference
Mar 13, 2018 | TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
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