SMT, PCB Electronic Industry News

News Releases from Shenmao Technology Inc.

Read Shenmao Technology Inc. company news


98 news releases added by Shenmao Technology Inc.

Company Information:

Shenmao Technology Inc.

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

TaoYuan County, Taiwan

Manufacturer

  • Phone +886-3-416-0177
  • Fax +886-3-416-0133

Shenmao Technology Inc. website

Company Postings:

(18) products in the catalog

(98) news releases

High Thermal Impact Reliability BGA Sphere from SHENMAO

Jul 16, 2022 | SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

Jun 24, 2022 | SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing

May 18, 2022 | SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

SHENMAO Offers Low-Temperature Lead-Free Solder Paste for Sensitive Components

Apr 13, 2022 | SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.

SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements

Mar 14, 2022 | SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.

SHENMAO Offers Halogen-Free SM-862 Liquid Flux

Feb 25, 2022 | SHENMAO America, Inc. is pleased to offer its halogen-free SM-862 Liquid Flux that can replace the widely sold halogenated SM-816. The flux features low solid content and smooth flux residue, making it suitable for automatic wave soldering and manual dipping processes.

SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX

Jan 10, 2022 | SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

SHENMAO's New PF606-P245X Lead-Free Solder Paste Wins 2021 Mexico Technology Award

Nov 05, 2021 | SHENMAO America, Inc. is pleased to announce that it received a 2021 Mexico Technology Award in the category of Solder Paste for its new PF606-P245X Lead-Free Solder Paste. The award was announced at a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

SHENMAO to Exhibit New Solder Pastes with NeVo at productronica

Oct 11, 2021 | SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

Aug 26, 2021 | SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

New Thermal Fatigue Resistant Lead-free Solder Paste

Jun 08, 2021 | SHENMAO America, Inc. is pleased to introduce its PF918-P250Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

SHENMAO Establishes Testing Laboratory in Taiwan – Cheetah Inspection, Inc.

Apr 01, 2021 | SHENMAO is pleased to announce that it has established an independent testing laboratory in Taiwan called Cheetah Inspection Inc. The ISO/IEC 17025 approved testing laboratory is located in Hsinchu, and builds upon SHENMAO's 48 years of packaging and assembly experience.

SHENMAO Introduces Thermal Fatigue Resistant Solder Alloy

Mar 04, 2021 | SHENMAO America, Inc. has introduced its PF719-P250 thermal fatigue resistant solder alloy for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Mar 02, 2021 | SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

SHENMAO Introduces New Joint-Enhanced Solder Paste Series

Dec 01, 2020 | SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.

SHENMAO Develops New Joint-Enhanced Flux

Nov 09, 2020 | SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.

SHENMAO Awarded for Lead & Halogen-Free Solder Wire

Oct 27, 2020 | SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

SHENMAO Receives Two GLOBAL Technology Awards for New Solder Wire & Solder Paste

Oct 04, 2020 | SHENMAO America, Inc. received two 2020 GLOBAL Technology Awards in the categories of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire, and Solder Paste for its PF606-RT35 Room Temperature Solder (RTS). The awards were announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

SHENMAO Receives TwoGLOBAL Technology Awards for New Solder Wire & Solder Paste

Oct 03, 2020 | SHENMAO America, Inc. received two 2020 GLOBAL Technology Awards in the categories of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire, and Solder Paste for its PF606-RT35 Room Temperature Solder (RTS).The awards were announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

May 30, 2020 | SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

SHENMAO Introduces New Solder Wire for Automatic Soldering

May 25, 2020 | SHENMAO America, Inc. is pleased to introduce its new PF606-F13 lead-free and halogen-free solder wire designed for automatic soldering equipment. The new solder wire enhances high-precision soldering, soldering efficiency and offers stable soldering quality.

Advanced Liquid Flux and Low Temp Solder from SHENMAO at SMTA Silicon Valley Expo

Nov 25, 2019 | SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.

SHENMAO Awarded for New Low Temperature Solder at productronica

Nov 13, 2019 | SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.

SHENMAO Picks up Award for New Low Temperature Solder at SMTA Guadalajara

Oct 24, 2019 | SHENMAO America, Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

SHENMAO Showcasing Liquid Flux and Low Temp Solder at SMTA Guadalajara

Oct 08, 2019 | SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.

Visit SHENMAO at the SMTA Long Island Conference & Exhibition

Oct 08, 2019 | SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Thursday, October 17, 2019 at the Melville Marriott in Melville, NY. The company will showcase its PF735-PQ10 low temperature solder (LTS) and SM-862 Liquid Flux.

SHENMAO to Present at the 31st Annual Electronics Packaging Symposium

Aug 12, 2019 | SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”

SHENMAO to Exhibit Low-Temperature Solder Pastes at SMTA Ohio Expo

Jul 09, 2019 | SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.

SHENMAO SMF-WC53 Water-Soluble Ball-Attach Flux and Solder Sphere

Jun 02, 2019 | SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.

SHENMAO SM-901 Water-Based Wave Soldering Flux Ideal for Lead-Free and Tin-Lead Wave Soldering

May 27, 2019 | SHENMAO America, Inc.’s SM-901 Water-Based Wave Soldering Flux has been designed for use in lead-free and tin-lead wave soldering applications. The company also offers the SMCW Series Water-Based Cleaner, which is ideal for removing flux residues and other smudges.

SHENMAO Offers Water-Soluble Solder Paste for SMT and IC Packaging Applications

May 27, 2019 | SHENMAO America, Inc. introduces PW215 Water Soluble Solder Paste, ideal for SMT and IC packaging applications. With a wide reflow window, this water soluble solder paste can effectively fit into the design process for even the most complex SMT or IC assembly substrate designs.

SHENMAO Offers Quality Low-Temperature Solder Paste for SMT Devices

May 20, 2019 | SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.

SHENMAO Provides New Solder Paste for Automobile Electronics

May 13, 2019 | SHENMAO America, Inc. introduces PF719-P250, a new solder paste for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.

SHENMAO Offers Thermal Fatigue Resistance Pb-Free Solder Alloy

May 12, 2019 | SHENMAO America, Inc. offers PF719 Thermal Fatigue Resistance Pb-Free Solder Alloy. PF719 provides excellent thermal fatigue reliability. The alloy offers a similar operating temperature window to typical SAC alloys.

SHENMAO Announces Partnership with Ideal Sales, Inc.

Apr 16, 2019 | SHENMAO America, Inc. is pleased to announce that it has partnered with Ideal Sales, Inc. as its manufacturers’ representative in Southern California and Arizona.

SHENMAO to Exhibit Low-Temperature Solder Pastes at ECTC

Apr 15, 2019 | SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.

SHENMAO Provides Quality Solder Paste for SMT Assembly

Apr 01, 2019 | SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.

SHENMAO Offers Quality Solarjoin PV Ribbon to Meet High-Reliability Requirements

Mar 31, 2019 | SHENMAO America has more than 40 years of experience in delivering solder materials with effective research and development and total solution capabilities.

SHENMAO to Debut New Pastes & Fluxes at electronica China

Mar 05, 2019 | SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.

SHENMAO Picks up Third Award for New Liquid Flux

Jan 30, 2019 | SHENMAO America, Inc. is pleased to announce that it was awarded a 2019 NPI Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

SM-862 Liquid Flux.

SHENMAO to Debut New Solder Wire for Automatic Soldering Equipment at APEX

Jan 05, 2019 | SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.

PF606-F13 solder wire.

SHENMAO America Announces New Distribution Partnership in Mexico

Dec 18, 2018 | SHENMAO America, Inc. is pleased to announce the appointment of BERNA Electronics and REPCON Electronics as its distribution partners in Mexico. With more than 25 years of proven experience in the EMS industry, the companies have a presence in the main industrial and electronics manufacturing regions of Mexico.

SHENMAO America Partners with Southwest Systems Technology, Inc.

Dec 11, 2018 | SHENMAO America, Inc. is pleased to announce the appointment of Southwest Systems Technology, Inc. as its representative in the states of Texas, Oklahoma, Arkansas and Louisiana. The company has offices in Texas and Mexico.

SHENMAO America Appoints New Rep to Expand Midwestern Support

Dec 05, 2018 | SHENMAO America, Inc. is pleased to announce the appointment of MIDwest TEKnologies as its representative in the Midwest region. The manufacturers’ representative will provide sales and customer support for SHENMAO in MN, ND, SD and IA.

SHENMAO receives Mexico Technology Award for new liquid flux

Nov 16, 2018 | SHENMAO America is pleased to announce that it was awarded a 2018 Mexico Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

High Thermal & Impact Reliability Solder Alloys from SHENMAO at IWLPC

Oct 22, 2018 | SHENMAO Technology today announced plans to exhibit at the International Wafer-Level Packaging Conference, scheduled to take place Oct. 23-25, 2018 at the DoubleTree by Hilton San Jose in California. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys.

PF906-S and PF912-S solder alloys.

SHENMAO wins Global Technology Award for SM-862 Liquid Flux

Oct 17, 2018 | SHENMAO America, Inc. is pleased to announce that it was awarded a 2018 Global Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.

Flux for its SM-862 Liquid Flux.

SHENMAO Technology Inc. Exhibits at NEPCON Vietnam 2018

Oct 01, 2018 | SHENMAO Technology, Inc. today announced plans to exhibit in Booth A21 at NEPCON Vietnam, scheduled to take place Oct. 11-13, 2018 at the Saigon Exhibition and Convention Center in Ho Chi Minh, Vietnam. SHENMAO will introduce the PF606-P245 solder paste PF606-F13 as well as the PF604-JF3 solder wires.

SHENMAO Launches the SMF-UL51 Ultra-Low-Residue Flux for No-Clean Packaging Processes

Sep 26, 2018 | SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

Sep 18, 2018 | SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.

Pages: 1 2

SMT feeders

Inline Cleaning Machine Hydro-clean Array