Apr 03, 2015 | New Real Time Audit (RTA) Tool for the UltraFLEX platform.
Apr 03, 2015 | New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve test quality and yield of ICs for mobile applications.
Apr 03, 2015 | The Oasis Toolset is designed to address the unique test challenges posed by complex semiconductor devices.
Apr 03, 2015 | Sixth Generation RF Solution Focuses on Emerging LTE-Advanced and 802.11ac Challenges
Apr 03, 2015 | United Test and Assembly Center, Ltd. (UTAC) selected the J750EX-HD and placed a multi-system order.
Apr 03, 2015 | Ms. Johnson has more than 25 years of financial management experience in technology driven global businesses.
Apr 03, 2015 | New System Architected to Optimize Digital Bus and Real-time Testing of Circuit Boards, Assemblies and Systems
Apr 03, 2015 | Expands Solutions for High Speed Avionics Data Bus Testing
Apr 03, 2015 | Q4'14 Revenue of $323 million, up 13% year over year and full year revenue up 15% Quarterly cash dividend of $0.06 and $500 million share repurchase program announced
Apr 03, 2015 | Technical Knowledge Exchange Brings Together ATE Industry's Best Minds
Apr 03, 2015 | Visit Teradyne in Booth#3101 at SEMICON China
Apr 03, 2015 | New High Density (HD) Instruments Increase Parallel Test Capability for Both Wafer and Final Test of Image Sensors
Apr 03, 2015 | J750-LitePoint Solutions Lower Test Costs for Wireless Connectivity and RF SOC Devices
Aug 30, 2011 | The Teradyne Users Group (TUG) has announced the 2012 Call for Papers for its annual conference at the Hilton Head Marriott in Hilton Head, South Carolina on April 30 through May 2, 2012. The event provides Teradyne customers and engineers with knowledge, tools and techniques to enhance their jobs.
Jul 14, 2011 | Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
Jul 14, 2011 | Sino IC Technology selected the Teradyne® UltraFLEX® to test RF, baseband and broadband devices. Sino IC Technology chose the UltraFLEX based on its high parallelism, superior accuracy and broad spectrum of instrumentation.
Feb 21, 2011 | Teradyne, Inc. announced today that it has reached an agreement to sell its Automotive Diagnostic Solutions unit to SPX Corporation. Diagnostic Solutions, which serves transportation OEMs, tier-one suppliers and independent service providers is based in Manchester, England and has other major operations in Munich and Detroit. The terms of the sale were not disclosed. Completion of the transaction is expected no later than the second quarter 2011.
Feb 17, 2011 | Teradyne, Inc. announces that Solution Sources Programming (SSP), a global leader in providing state-of-the-art test solutions for the high-tech, medical, military, industrial and consumer electronics industries, has taken delivery of the Teradyne® flagship in-circuit test system, the TestStation LX™.
Feb 07, 2011 | Teradyne, Inc. announced that registration is now open for the 2011 Teradyne Users Group (TUG) conference at the Hard Rock Hotel in San Diego, CA on May 2-4. Reza Zoughi, Ph.D. will present this year's keynote address: "Advances in Microwave and Millimeter Wave Imaging and System Development for Nondestructive Testing & Evaluation (NDT&E)."
Jan 26, 2011 | Teradyne announced the election of Timothy Guertin to its Board of Directors on January 24.
Nov 03, 2010 | Teradyne, Inc announced that Unisem has selected the ETS-88™ test system from Teradyne’s Eagle Test business unit, based on the platform’s scalability, flexibility and superior test economics.
Oct 30, 2010 | Teradyne, Inc. reported revenue of $502 million for the third quarter of 2010 of which $448 million was in Semiconductor Test and $54 million in Systems Test Group.
Oct 08, 2010 | Teradyne, Inc. (NYSE: TER) announced that Realtek has selected the J750Ex for wafer sort and final test of their devices.
Oct 06, 2010 | The Teradyne Users Group (TUG) has announced the 2011 Call for Papers for its 28th annual conference at the Hard Rock Hotel in San Diego, CA on May 2-4, 2011. The event provides Teradyne customers and engineers with knowledge, tools and techniques to enhance their jobs. A collection of technical presentations, workshops and round table discussions awaits attendees and presenters at the ATE industry’s longest running users group conference.
Aug 30, 2010 | Teradyne, Inc. (NYSE: TER) announced the election of Daniel W. Christman to its Board of Directors.
Jul 29, 2010 | Teradyne, Inc. (NYSE: TER) reported revenue of $455 million for the second quarter of 2010 of which $413 million was in Semiconductor Test and $42 million in Systems Test Group. On a non-GAAP basis, Teradyne’s net income in the second quarter was $133.7 million, or $0.69 per diluted share, which excluded acquired intangible asset amortization, non-cash convertible debt interest and restructuring and other charges.
Jul 20, 2010 | Teradyne, Inc. (NYSE: TER) will release financial results for the second quarter 2010 on Wednesday, July 28 at 6:30 p.m. Eastern Daylight Time (EDT) or later.
Jul 09, 2010 | Teradyne, Inc. (NYSE: TER), a world leader in high efficiency, low-cost test, announced that more than 240 Teradyne users and test professionals participated in the 27th annual Teradyne Users Group (TUG) Conference in Hilton Head, SC on May 3-5. TUG is the test industry's largest and longest running customer user group conference. Among the participants this year were customers of Teradyne’s Eagle and Nextest business units.
Jul 07, 2010 | Teradyne, Inc. (NYSE: TER) has been recognized by Texas Instruments (TI) with a 2009 Supplier Excellence Award. The award, given annually, honors companies whose dedication and commitment in supplying products and services meets TI's high standards for excellence.