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News Releases from i3 Electronics

Read i3 Electronics company news


26 news releases added by i3 Electronics

Company Information:

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Assembly, Component Packaging, Contract Manufacturer, Manufacturer of Assembled PCBs, Manufacturer of Bare PCBs

  • Phone 866 820-4820
  • Fax 607 755-7000

i3 Electronics website

Company Postings:

(3) products in the catalog

(20) technical library articles

(26) news releases

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Dec 03, 2010 | Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.

Adhesiveless, fil-based, liquid crystal polymer, high performance laminate.

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jul 08, 2008 | ENDICOTT, NY� Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. has been named a recipient of the 2008 Ernst & Young Entrepreneur of the Year award in the advanced technology solutions category for the Upstate New York, Western Pennsylvania and West Virginia region.

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

Jun 19, 2008 | ENDICOTT, N.Y.� Congressman Michael Arcuri, representing New York�s people of the 24th district, visited Endicott Interconnect Technologies, Inc. (EI) on Thursday, May 29th, 2008. Also attending was Binghamton University President Lois DeFleur, who along with James McNamara, President and CEO of EI, highlighted the growing high-tech economy in the Southern Tier Region.

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 | Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

May 12, 2008 | Microelectronics Manufacturing (CAMM) located at the Endicott Interconnect Technologies, Inc. facility was inaugurated on Monday, March 31st, in a ceremony attended by business, political and community leaders.

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Feb 19, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that they have again achieved platinum level status for surpassing the $100,000 mark in contributions to the United Way of Broome County for the fourth year in a row.

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) has announced the appointment of Steven Burke to the position of chief financial officer for the company, a move that strengthens EI�s management team during a period of accelerating growth.

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) has named Sharon Pinto to the position of vice president, human resources effective immediately.

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Nov 08, 2007 | Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract

May 30, 2007 | Endicott, NY� May 29, 2007. Endicott Interconnect Technologies, Inc. today announced that the U.S. Department of Defense has awarded a $49M follow-on production contract that includes a $5M contract for research and development of electronics packaging technologies including printed circuit boards and substrates for the next generation of high productivity computing.

Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies- Manufacturer Now Largest User of LDI Technology in the Americas

May 30, 2007 | Billerica, MA � May 24, 2007. Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.

EI Honors Patent Recipients

Feb 15, 2006 | ENDICOTT, NY � January 31, 2006

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