News Releases from Nihon Superior Co., Ltd.
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163 news releases added by Nihon Superior Co., Ltd.
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Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024
Mar 18, 2024 | Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.
Nihon Superior's Keith Sweatman Wins a Coveted SMTA International Best Paper Award
Nov 13, 2023 | Nihon Superior Co. Ltd. proudly announces that their Senior Technical Advisor, Keith Sweatman, has been honored with a coveted SMTA International Best Paper Award. This prestigious award was presented during the SMTA International 2023 Recognition Dinner, where Keith Sweatman was acknowledged as one of the four speakers who presented papers at the 2022 conference that were judged by their peers as the best in their respective categories.
Nihon Superior and FCT Solder Extend Partnership with SN100CV License Agreement
Nov 06, 2023 | Nihon Superior Co. Ltd. are delighted to announce the renewal of their longstanding partnership. In a testament to their shared success, Nihon Superior has granted FCT Solder a license for its innovative SN100CV solder alloy, reaffirming their commitment to collaboration. With this renewed partnership, FCT Solder has earned the distinction of being the first and exclusive licensee of Nihon Superior's SN100CV alloy in North America.
Nihon Superior's Mr. Keith Sweatman to Present at the 2023 SMTA International Technical Conference
Oct 02, 2023 | Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, the company's Senior Technical Advisor, will deliver a presentation titled "A Path to Ductile Low-Temperature Solders for Mass Production of Electronic Assemblies" at the upcoming SMTA International conference and exposition. This prestigious event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention Center in Minneapolis, MN. Keith Sweatman's presentation is scheduled within session LTS4, titled "Effects of Elemental Additions to Sn-Bi solder Alloys," and will take place on Thursday, Oct. 12, 2023, from 8:30 to 10:00 a.m.
Nihon Superior to Highlight SN100CV P608 Paste at SMTAI
Sep 11, 2023 | Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.
Nihon Superior Launches Ag-free SAC305 Replacement – SN100CV
Jan 09, 2023 | With its rule-breaking wave solder alloy, SN100C, Nihon Superior Co., Ltd. earned global recognition as an innovator in lead-free solder formulation. The rule that SN100C broke was that you can't make a Pb-free solder without a silver content that doubles the cost of the raw materials. Now Nihon Superior has broken that rule again with SN100CV, a reflow soldering alloy that can outperform SAC305 in reliability while being reflowable with the same thermal profile as SAC305.
Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX
Dec 21, 2022 | Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.
Nihon Superior Introduces Lead-Free Solder Paste for Automotive Requirements
Nov 15, 2022 | Nihon Superior Co. Ltd. is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2 is the high-strength alloy of choice when cracking minimization is a key selection criterion.
Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI
Oct 06, 2022 | Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1230 at the SMTA International Exposition, scheduled to take place Nov. 2-3, 2022 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.
Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX
Jan 03, 2022 | Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI
Oct 07, 2021 | Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.
Nihon Superior Receives Honorable Mention in SMTA International Best Paper Awards
Feb 08, 2021 | Nihon Superior Co. Ltd. is pleased to announce that Senior Technical Advisor Keith Sweatman received an Honorable Mention from the SMTA for the "Best of Proceedings" Award for SMTA International 2020. The members of the conference technical committee selected his paper, "Behavior and Strengthening Effects of Sb in a Low Bi-Sn-Cu alloy" on the basis that it represented the integrity and technical quality for which the SMTAI International program is known.
Nihon Superior Commemorates 55 Years of Innovation in Soldering Materials
Jan 06, 2021 | Nihon Superior Co. Ltd. is pleased to announce its 55th year in business. Toshiro Nishimura, Chairman and founder, started the company by importing brazing alloys and supplying them to Japanese companies in the metal-joining industry.
Nihon Superior's Senior Technical Advisor will participate in Low Temperature Solder Panel Discussion
Dec 04, 2020 | Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, Senior Technical Advisor, will participate in a panel discussion on Tuesday, Dec. 8, 2020 at 7:30 a.m. PCT / 10:30 a.m. EST / 3:30 p.m. GMT / 4:30 p.m. CET. The panel discussion is entitled "Low temperature solders – revisited."
Nihon Superior Receives NPI Award for New TipSave N Flux-Cored Solder Wire
Feb 06, 2020 | Nihon Superior Co. Ltd. was awarded a 2020 NPI Award in the category of Cored Wire for its new TipSave N flux-cored solder wire. The award was presented to the company during a Tuesday, Feb. 4, 2020 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Nihon Superior Wins 2020 IPC APEX EXPO Innovation Award for New Flux-Cored Solder Wire
Feb 06, 2020 | Nihon Superior Co. Ltd. was awarded an IPC APEX EXPO 2020 Innovation Awardon Tuesday, Feb. 4, 2020 during the opening keynote.
Nihon Superior to Exhibit TipSave N at APEX 2020
Jan 06, 2020 | Nihon Superior Co. Ltd. is pleased to announce plans to showcase its new TipSave N flux-cored solder wire in Booth #2043 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company also will exhibit SN100CV P608 D5 solder paste.
Nihon Superior extends soldering iron tip life by 3X with new TipSave N flux-cored solder wire
Oct 29, 2019 | Nihon Superior Co. Ltd. is pleased to announce the introduction of its new TipSave N flux-cored solder wire. The newly developed TipSave N flux-cored solder wire extends soldering iron tip life by 3X.
SN100C Celebrates 20 Years of Reliability Service
Aug 21, 2019 | Nihon Superiorwill exhibit in Booth #518 at 2019 SMTA International. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Nihon Superior to introduce TipSave N flux-cored solder at NEPCON Asia
Aug 17, 2019 | OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
SN100C Celebrates 20 Years of Reliable Service at APEX
Jan 04, 2019 | Nihon Superior today announced plans to exhibit in Booth #1334 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29 - 31, 2019 at the San Diego Convention Center in Ca. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. SN100C (032) flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
New SN100CV solder paste from Nihon Superior at SMTAI reduces voiding
Sep 18, 2018 | Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.
Nihon Superior Introduces Improved Flux-Cored Solder Wire
Sep 11, 2018 | Nihon Superior Co.has developed a new flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The new cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures.
Nihon Superior to Exhibit New SN100CV Solder Alloy at NEPCON South China
Jul 24, 2018 | Nihon Superior scheduled to take place Aug. 28-30, 2018 at the Shenzen Convention & Exhibition Center. The company will debut the new SN100CV™ P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Nihon Superior to Exhibit the New SN100CV Solder Alloy at NEPCON China
Apr 03, 2018 | Nihon Superior will exhibit in Stand 2L31 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Nihon Superior Rebrands SN100C Alloy with New Logo
Mar 27, 2018 | Nihon Superior Co.is pleased to introduce its new SN100C logo. The logo replaces the originally used SN100C logo and will be used worldwide to brand this important alloy. The announcement was made during the recent IPC APEX EXPO in San Diego.
Tetsuro Nishimura Earns IPC Distinguished Committee Service Award
Mar 22, 2018 | Nihon Superior today announced that its President Tetsuro Nishimura has received a Distinguished Committee Service Award in recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry. IPC – Association Connecting Electronics Industries® presented the award at the recent IPC APEX EXPO that took place at the San Diego Convention Center.
Nihon Superior to Introduce New SN100CV Solder Alloy at APEX
Jan 28, 2018 | Nihon Superior will exhibit in Booth #1019 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in California. The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI
Aug 15, 2017 | Nihon Superior will exhibit in Booth #532 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China
Aug 10, 2017 | Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.
Nihon Superior Wins a 2017 NPI Award for the Latest SN100CVTM Lead-Free No-Clean Paste
Feb 16, 2017 | Nihon Superior announces that it has been awarded a 2017 NPI Award in the category of Soldering Materials for its SN100CV P506 D4 Lead-Free Solder Paste. The award was presented to the company’s President, Tetsuro Nishimura during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining
Jan 10, 2017 | Nihon Superior will exhibit in Booth #2610 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International
Aug 30, 2016 | Nihon Superior Co. will exhibit in Booth #418 at SMTA International, scheduled to take place September 27-28, 2016 at Donald Stephens Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments
Mar 09, 2016 | Nihon Superior is pleased to announce a great turnout for its 50-year anniversary celebration. The event took place at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration began with a sightseeing tour to Kyoto, followed by the anniversary celebration dinner with cask opening ceremony.
Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO
Feb 16, 2016 | Nihon Superior will exhibit in Booth #2610 at the IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan
Dec 28, 2015 | Nihon Superior will exhibit in East Hall 1 E3-18 at NEPCON Japan, scheduled to take place Jan. 13-15, 2016 at the Tokyo Big Site in Japan. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Nihon Superior to Hold 50th Anniversary Celebration in Japan
Oct 21, 2015 | Nihon Superior Co. is pleased to announce that its 50-year anniversary celebration will take place Oct. 23, 2015 at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration will kick off on Oct. 22 with a sightseeing tour to Kyoto, followed by the anniversary ceremony on Oct. 23, and will conclude with a sightseeing tour to Hyogo prefecture (Kobe) on Oct. 24.
Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI
Oct 11, 2015 | Nihon Superior announces that Tetsuro Nishimura was awarded Best Inventor by SMT Today Magazine during the recent SMTA International Conference & Exhibition. The award was presented to Mr. Nishimura on Tuesday, Sept. 29, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Best Inventor Award recognizes an individual or team whose innovation/s have not only addressed a need and solved a problem but have also been used to drive improved efficiency, productivity and performance within the electronics manufacturing industry.
Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI
Aug 26, 2015 | Nihon Superior Co. will exhibit in Booth #419 at SMTA International, scheduled to take place Sep. 27 - Oct. 1, 2015 at the Donald Stephens Convention Center in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder; SN100C® has seen its 15th anniversary and its usage is still expanding. The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Nihon Superior Acknowledged for 2015 SMTAI Sponsorship
Jun 21, 2015 | Nihon Superior Co. will sponsor the SMTA International Conference & Exhibition, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Nihon Superior is a Refreshment Break Sponsor.
Nihon Superior Announces Successful Product Launches at NEPCON Japan
Jan 27, 2015 | Nihon Superior recently exhibited at NEPCON Japan at the Tokyo Big Sight in Japan. The company had a successful show with high interest in its newly developed products and several new technologies.
Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO
Jan 19, 2015 | Nihon Superior Co. will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste.
Keith Sweatman Co-Authors Paper for SMTAI Technical Sessions
Aug 28, 2014 | Nihon Superior Co. Ltd. announces that Keith Sweatman will present the paper titled ”Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold” at the upcoming SMTA International exhibition.
Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI
Aug 26, 2014 | Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Nihon Superior Opens New Southeast Asia Headquarters
Jun 19, 2014 | Nihon Superior Co. Ltd. announces that it has opened a new regional headquarters – Nihon Superior Asia Sdn. Bhd. (NSA), in Petaling Jaya, Malaysia.
Nihon Superior Thanks SN100C Licensees and Partners
May 07, 2014 | Nihon Superior Co. Ltd. is pleased to announce its success from the recent IPC APEX EXPO in Las Vegas, Nevada.
Nihon Superior’s New General Purpose Solder Wire Wins a 2014 NPI Award
Mar 26, 2014 | Nihon Superior Co. Ltd. announces that it has been awarded a 2014 NPI Award in the category of Cored Wire for its SN100C (031) Lead-free Flux-Cored Solder Wire.
Nihon Superior Brings Cutting-edge Pastes to the IPC APEX EXPO
Feb 19, 2014 | Nihon Superior Co. Ltd Nihon Superior will exhibit in Booth #2353 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Nihon Superior to Launch New Advanced Pastes at INTERNEPCON Japan
Jan 07, 2014 | Nihon Superior Co. Ltd. announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17, 2014 at the TOKYO BIG SITE in Tokyo, Japan.
Nihon Superior to Sponsor FIRST® Robotics Competition at SMTAI
Oct 09, 2013 | Nihon Superior Co. Ltd.will sponsor the FIRST Robotics competition at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
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