News Releases from Akrometrix
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25 news releases added by Akrometrix
Company Information:
Akrometrix Answers the Industry’s Demand for an Ultra-Fast Tabletop Warpage Metrology System Just in Time for productronica
Oct 16, 2017 | Akrometrix will display its newest warpage metrology system in Hall A3, Stand 102/1 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München, in Germany. The new Tabletop Shadow Moiré (TTSM) system offers all of the software features of Akrometrix’s thermal warpage metrology systems in a room temperature unit which provides full field-of-view measurement in less than two seconds.
Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”
Aug 30, 2017 | Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.
Akrometrix Launches New Tabletop Shadow Moiré (TTSM) at SMTA International
Aug 14, 2017 | Akrometrix will display its newest warpage metrology system in Booth #124 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The new Tabletop Shadow Moiré (TTSM) system responds to the industry’s demand for an ultra-fast tabletop warpage metrology system.
Akrometrix Launches New Warpage Metrology System – the Tabletop Shadow Moiré (TTSM)
Jun 29, 2017 | Akrometrix is pleased to announce that it has launched its newest warpage metrology system – the Tabletop Shadow Moiré (TTSM) system.
Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX
Feb 15, 2017 | Akrometrix is pleased to announce that it has been awarded a 2017 NPI Award in the category of First Article Inspection for the new AXP 2.0. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Akrometrix to Showcase Next-Generation AXP Shadow Moiré System at APEX
Jan 10, 2017 | Akrometrix will exhibit in Booth #704 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The company will demonstrate its next-generation Shadow Moiré System – the AXP 2.0.
Akrometrix Announces Next-Generation AXP Shadow Moiré System
Oct 04, 2016 | Akrometrix today announced its next-generation Shadow Moiré System – the AXP 2.0.
Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI
Sep 23, 2016 | Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.
Akrometrix Announces New Schedule for Technical Presentations
Sep 22, 2016 | Akrometrix today announced its upcoming schedule for technical presentations:
Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology
May 05, 2016 | Akrometrix today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology.
Akrometrix Announces the Shipment of Its 300th Shadow Moiré System
Apr 29, 2016 | Akrometrix today announced that the company has shipped its 300th shadow moiré metrology system to a leading back-end company in South Korea.
Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module
Mar 30, 2016 | Akrometrix today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.
Akrometrix Announces Automated Die Attach Tilt Metrology
Feb 25, 2016 | Akrometrix today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or DFP systems (AXPs) can be upgraded with the new feature.
Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech
Feb 23, 2016 | Akrometrix will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.
PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos
Feb 18, 2016 | Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX
Feb 17, 2016 | Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Akrometrix LLC Debuts the AKM600P – FOWLP Panel Warpage Measurement System
Dec 02, 2015 | Akrometrix LLC today announced the company’s entry into the Fan Out Wafer Level Processing (FOWLP) market with an innovative, single shot full field of view warpage metrology system for panels up to 600 x 600 mm.
Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1
Oct 22, 2015 | Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Discover 2D/3D Interface Analysis Software from Akrometrix LLC at SMTAI
Aug 24, 2015 | Akrometrix will exhibit in Booth #134 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
Mayson Brooks Joins Akrometrix LLC as President & CEO
Jul 01, 2015 | Akrometrix is pleased to announce that Mayson Brooks has joined the company as President & CEO, effective July 6, 2015. Mr. Brooks brings significant experience in semiconductor inspection and metrology for both front and back-end applications, especially in advanced packaging, which is an excellent fit for the strategic direction of Akrometrix.
Akrometrix LLC’s CXP to Be Displayed at SMT/Hybrid/Packaging 2015
Apr 07, 2015 | Akrometrix will display the latest surface measurement equipment platform, the CXP, in the Microtronic Booth, #7-101L, at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg Germany.
Akrometrix LLC to Demonstrate 2D/3D Interface Analysis Software at APEX
Jan 21, 2015 | Akrometrix will exhibit in Booth #2935 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
Akrometrix LLC to Present PoP Reflow Assembly Findings at IEMT
Oct 14, 2014 | Akrometrix LLC will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia.
Akrometrix LLC to Demonstrate 2D/3D Statistical Review Software at SMTAI – Interface Analysis
Aug 26, 2014 | Akrometrix LLC will exhibit in Booth #541 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
TELTEC to Represent Akrometrix LLC Surface Measurement Tools in Europe
Aug 26, 2014 | Akrometrix LLC is pleased to announce the appointment of TELTEC as its representative throughout Europe.
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