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News Releases from MARTIN (a Finetech company)

Read MARTIN (a Finetech company) company news


8 news releases added by MARTIN (a Finetech company)

Company Information:

MARTIN (a Finetech company)

Manufacturer of rework and reballing systems, hand soldering solutions, and micro-dispensing technologies

Manchester, New Hampshire, USA

Adhesives / Dispensing, Manufacturer of Assembly Equipment, Repair / Rework, Soldering

  • Phone 603-627-8989

MARTIN (a Finetech company) website

Company Postings:

(6) products in the catalog

(2) technical library articles

(8) news releases

MARTIN Introduces IR Temperature Measurement Sensors for ENHANCED Rework

Apr 24, 2013 | MARTIN is announces that Infrared temperature (IR) measurement sensors now are available on its EXPERT 10.6 Rework Systems

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum

Apr 19, 2012 | MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum,

 Mini-Oven Reball/Solder Bumping Unit

MARTIN to Demonstrate Affordable Rework Solutions at the 2012 IPC APEX Expo

Jan 20, 2012 | MARTIN will showcase its MINIOVEN Reball/Prebump unit, Expert 10.6 rework system and Clever Dispense unit at the upcoming IPC APEX Expo.

The MINIOVEN 04 provides a reflow environment in a compact, stand-alone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs.

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at SMTA LA/Orange County Expo

Oct 07, 2011 | MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum.

The Mini-Oven 04 provides controlled air circulation, ensuring that hot air continually flows around the component and thus heats it equally from all sides.

MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011

Sep 19, 2011 | MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.

MARTIN’s Mini-Oven 04 Reball/Prebump unit is ideal for the complete QFN solder bumping process, even for the smallest pitches.

LEDs Are Well On The Way To Becoming The Most Innovative Components With The Fastest Growth Rate

Jul 27, 2011 | The use of these small, illuminating and energy efficient components is steadily increasing, thereby influencing electronic assemblers to seriously consider the placement, soldering and possible rework of LEDs.

LED Rework

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

May 10, 2011 | MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.

Mini-Oven 04 Reball/Prebump unit

MARTIN Launches Web Site for North American Market

Apr 07, 2011 | MARTIN announces the launch of its new North American Web site. The new easy-to-navigate site, located at www.bgarework.com, highlights the company’s rework and dispensing products available in North America.

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