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News Releases from GOEPEL Electronic

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8 news releases added by GOEPEL Electronic

Company Information:

GOEPEL Electronic

Vendor of systems for Automated Optical Inspection (AOI), 3D X-Ray Inspection (AXI)and 3D solder paste inspection (SPI). The company's inline and stand-alone AOI systems won several "Best in Test Awards"

Jena, Germany


  • Phone +49 (0)3641 6896-0

GOEPEL Electronic website

Company Postings:

(16) products in the catalog

(2) technical library articles

(8) news releases

Goepel Presents Free Webinar on Quality Control of Plug-in Contacts Using 3D Measurement

Oct 13, 2015 | Goepel is pleased to announce their latest webinar, "3D Circumference Inspection for Connector Insertion - Quality Control of Plug-in Contacts using 3D Measurement Method" on Tuesday, October 27th.

eXception integrates GOEPEL electronic's Boundary Scan into Teradyne Test Station

Jul 20, 2011 | The British Contract Electronics Manufacturing Company eXception EMS has simplified and integrated Boundary Scan solutions into mainstream test strategy by incorporating equipment from GOEPEL electronic into a Teradyne test station.

GOEPEL electronic supports Picochip in testing next Generation 'Small cell' Baseband chips

Jul 13, 2011 | GOEPEL electronic has developed special VarioTAP® IPs for testing the new generation femtocell chips in cooperation with Picochip. The solution enables dynamic processor emulation tests (PET) for fault detection and diagnostic on board and system level, as well as supporting embedded Flash programming.

GOEPEL electronics runs 9th UK Technology Day in 2011

Mar 22, 2011 | GOEPEL electronics will run its 9th UK Technology Day. This event will take place on the 5th May 2011 in Duxford. The seminars will be covering latest developments, applications and outlooks in JTAG/Boundary Scan, Functional Test and optical inspection technologies.

GOEPEL electronic improves in-system Programming Capability of Flash Memories

Mar 10, 2011 | GOEPEL electronic announces the market introduction of another feature within the frame of the emulation technology VarioTAP®. The new option enables the utilisation of fast process-oriented communication interfaces such as LAN or USB2.0 for data transfer, in particular solving the throughput problem in programming massive Flash images.

GOEPEL electronic extends BSDL Testbench to Multi Chip Modules and 3D Chips

Mar 09, 2011 | GOEPEL electronic, world-class vendor of JTAG/Boundary Scan solutions announces the availability of a new option in its recently introduced EDA software TAPChecker™. Multi-Chip Modules (MCM) and 3D chips are now supported, allowing testbench generation for VHDL, Verilog and STIL output formats.

TAPChecker™ is based on a modular platform architecture with central database and individually licensable modules for data import and export as well as automatic test vector generation.

Cooperation between GOEPEL electronic and DM&P enables new Test Strategies for x86 System-On-Chip

Mar 03, 2011 | GOEPEL electronic has developed special VarioTAP® IPs for testing VORTEX x86 chip series in cooperation with the Taiwanese Company DMP.

Source:  DM&P (

Fast Generation of production-oriented AOI Programs

Feb 26, 2011 | The newest version of GOEPEL electronic's AOI system software features a special highlight. An integrated debug statistics captures AOI relevant variations in the production process and provides them for statistical evaluations.

GOEPEL electronic’s OptiCon systems can be applied for Automated Optical Inspection of assembled PCBs before as well as after the soldering process.
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