SMT, PCB Electronic Industry News

News Releases from JEDEC Solid State Technology Association

Read JEDEC Solid State Technology Association company news


8 news releases added by JEDEC Solid State Technology Association

Company Information:

JEDEC Solid State Technology Association

JEDEC is the global leader in developing open standards for the microelectronics industry, with more than 3,000 volunteers representing nearly 300 member companies.

Arlington, Virginia, USA

Association / Non-Profit

  • Phone (703) 907-7534

JEDEC Solid State Technology Association website

Company Postings:

(8) news releases

JEDEC Publishes Breakthrough Standard for Wide I/O Mobile DRAM

Jan 13, 2012 | JEDEC announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry, Wide I/O mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices.

JEDEC Publishes Breakthrough Standard for Wide I/O Mobile DRAM

Jan 07, 2012 | JEDEC Solid State Technology Association announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry, Wide I/O mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices.

JEDEC Announces Key Attributes of Upcoming DDR4 Standard

Aug 24, 2011 | JEDEC Solid State Technology Association announced selected key attributes of its widely-anticipated DDR4 (Double Data Rate 4) standard.

JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B)

Jun 22, 2011 | JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B.

JEDEC Announces Publication of e-MMC Standard Update v4.5

Jun 16, 2011 | JEDEC Solid State Technology Association announced the publication of JESD84-B45: Embedded MultiMediaCard (e•MMC), Electrical Standard (Version 4.5 Device).

JEDEC Announces Broad Spectrum of 3D-IC Standards Development

Mar 21, 2011 | JEDEC Solid State Technology Association announced a broad spectrum of ongoing standards development work related to 3D-ICs.

JEDEC Announces Publication of Universal Flash Storage (UFS) Standard

Feb 24, 2011 | JEDEC Solid State Technology Association today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.

JEDEC to Standardize Hybrid Memory Modules

Feb 10, 2011 | JEDEC Solid State Technology Association announces that its JC-45 Committee for DRAM Modules intends to form a new Subcommittee focused on the standardization of hybrid memory modules.

Conformal Coating Machine under 40000

Industry 4.0 Reflow Oven