News Releases from Hesse Mechatronics
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14 news releases added by Hesse Mechatronics
Company Information:
Hesse Mechatronics Appoints Representative for South America
Jan 24, 2014 | Hesse Mechatronics has appointed HTMG as the company's sales representative for South America.
Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica
Oct 31, 2013 | Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.
New Dual-Head Wedge Bonder Makes Americas Debut
Jun 07, 2013 | Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development
May 06, 2013 | Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.
Hesse Mechatronics, Inc. Appoints Senior Business Development Manager
Apr 13, 2013 | Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.
Hesse & Knipps is now Hesse Mechatronics
Mar 06, 2013 | Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Hesse & Knipps is now Hesse Mechatronics.
Mar 06, 2013 | Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding
Sep 04, 2012 | Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada
Aug 14, 2012 | Hesse & Knipps, Inc., (www.hesse-knipps.com) has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY, NJ, DE, MD, PA, WV, VA, NC, SC, GA and FL) as well as the Canadian provinces of Quebec and Ontario
Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada
Aug 02, 2012 | Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.
Hesse & Knipps, Inc. Appoints New Technical Training Manager
Jul 25, 2012 | Hesse & Knipps, Inc.,has appointed Allan Camp as Technical Training Manager.
Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting
May 30, 2012 | Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Hesse & Knipps To Discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” at IMAPS Advanced Technology Workshop
May 11, 2012 | Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast
Feb 15, 2012 | Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep - Chalman Technologies - in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.
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