SMT, PCB Electronic Industry News

News Releases from YINCAE Advanced Materials, LLC.

Read YINCAE Advanced Materials, LLC. company news


39 news releases added by YINCAE Advanced Materials, LLC.

Company Information:

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

Adhesives/Dispensing, Manufacturer of Assembly Material

  • Phone 5184522880

YINCAE Advanced Materials, LLC. website

Company Postings:

(26) products in the catalog

(15) technical library articles

(39) news releases

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

Sep 04, 2018 | YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.

Process diagram for SMT 158HA.

YINCAE at IWLPC 2018

Jul 19, 2018 | (Albany, NY) July 16, 2018: YINCAE is excited to announce that we will be attending the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition in San Jose, CA this year from October 23rd-25th at the Double Tree by Hilton. This conference brings together many of the top performers in the semiconductor industry and addresses all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

Jul 03, 2018 | (Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.

Underfill Tree Poster

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

Jul 03, 2018 | (Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.

YINCAE’S SMT 158A Receives High Praise

May 18, 2018 | As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

May 14, 2018 | The world's first commercial diamond filled underfill.

SEMICON WEST 2018 is in 1 Month! VISIT YINCAE BOOTH 5269

May 08, 2018 | SEMICON WEST 2018 is 1 month away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to offer.

Underfill Tree Materials

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Apr 09, 2018 | (Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

SEMICON West is 3 months away! Visit YINCAE at Booth #5269

Mar 30, 2018 | Visit YINCAE at Booth #5269

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Feb 14, 2018 | Press Release DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Press Release: DA 90 Low Temperature Die Attach Adhesive Series Materials

Feb 14, 2018 | Press Release DA 90 Low Temperature Die Attach Adhesive Series Materials

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Feb 14, 2018 | Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

PRESS RELEASE: IPC APEX is 2 Weeks Away!

Feb 08, 2018 | IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Jan 16, 2018 | Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

Jan 16, 2018 | Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017 | (Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017 | (Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

SMT 158UL Highly Filled Room Temperature Underfill

Jun 13, 2017 | YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.

SMT 88UL Super-Fast Flow Room Temperature Underfill

Jun 06, 2017 | YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.

New Innovative Solder Joint Encapsulant Paste: SMT 256EP

Jun 05, 2017 | YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).

PRESS RELEASE: New Product Announcement

Jan 24, 2017 | BP 256 is YINCAE’s new ball attach adhesive product

SMTA INTERNATIONAL JUST A MONTH AWAY! VISIT YINCAE BOOTH #129 September 27th & 28th

Aug 24, 2016 | SMTA international is just a month away!

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448

Jun 22, 2016 | Visit YINCAE Booth 6448

YINCAE at ECTC in Las Vegas in 2 weeks!!

May 18, 2016 | ECTC is 2 weeks away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV, June 1st and 2nd. YINCAE hopes you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

ECTC is 1 Month Away Visit YINCAE Booth 506

Apr 27, 2016 | ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials at IMAPS NE Booth # 101

Apr 25, 2016 | IMAPS New England is 1 week away! VISIT YINCAE Booth # 101 Join Dr. Yin’s Presentation May 3rd, 1PM

IMAPS New England 2016

Apr 08, 2016 | IMAPS New England is 1 month away! VISIT YINCAE Booth Join Dr. Yin’s Presentation May 3rd, 1PM

IPC APEX 2016 is 2 months away!

Jan 18, 2016 | The IPC APEX EXPO 2016 hosted by the Las Vegas Convention Center from March 15th – 17th is only two months away! Featuring world-class educational opportunities with leaders in industry practice and research, this year’s Forward Thinking for Tomorrow’s Technology theme will offer unparalleled opportunities to access solutions to industry experts. We look forward to helping you to meet your challenges and invite you to stop by our Booth 1718 to learn more about the innovative products and custom solutions that we offer.

YINCAE Advanced Materials Wins Global Technology Award at Productronica for World’s First Solder Joint Encapsulant

Nov 18, 2015 | Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany.

Solder Joint Encapsulant

May 13, 2015 | The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

SMT 158 -- A Underfill Solution for Miniaturization in Microelectronics

May 13, 2015 | The current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices.

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Sep 22, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

World’s Best Flip Chip Underfill: SMT 158 Series

Aug 12, 2014 | (Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Jul 28, 2014 | Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

SMT 88UH Fast Cure, Reworkable Underfill

Jul 08, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.

WORLD'S FIRST SUPER FAST LOW TEMPERATURE UNDERFILL

Jun 30, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.

YINCAE Advanced Materials LLC has been selected for the 2014 Best of Albany Awards for Manufacturers

Jun 18, 2014 | YINCAE is honored to accept this 2014 Best of Albany Awards for Manufacturers. YINCAE is the leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. It is very rewarding to know that local businesses and customers recognize YINCAE as an outstanding business. YINCAE will continue to serve and please the community as well as the customers. Customer satisfaction is the foundation of our company and YINCAE will continue ensure that every customer is more than satisfied with our product.

2014 Best of Albany Awards for Manufacturers

NEW ENCAPSULANT PRODUCT SERIES SOLVES THERMOCYCLING ISSUES

Jun 10, 2014 | (Albany, NY) June 10, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new encapsulant products that enable greater production temperature flexibility for microchips with different alloy applications.

fluid dispensing pumps for integration

SMT in-printer dispensing