News Releases from YINCAE Advanced Materials, LLC.
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59 news releases added by YINCAE Advanced Materials, LLC.
Company Information:
Solder Joint Encapsulant
May 13, 2015 | The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
SMT 158 -- A Underfill Solution for Miniaturization in Microelectronics
May 13, 2015 | The current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices.
Solder Joint Encapsulant for Ball Bumping Applications: BP 256
Sep 22, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
World’s Best Flip Chip Underfill: SMT 158 Series
Aug 12, 2014 | (Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.
An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates
Jul 28, 2014 | Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
SMT 88UH Fast Cure, Reworkable Underfill
Jul 08, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.
WORLD'S FIRST SUPER FAST LOW TEMPERATURE UNDERFILL
Jun 30, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
YINCAE Advanced Materials LLC has been selected for the 2014 Best of Albany Awards for Manufacturers
Jun 18, 2014 | YINCAE is honored to accept this 2014 Best of Albany Awards for Manufacturers. YINCAE is the leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. It is very rewarding to know that local businesses and customers recognize YINCAE as an outstanding business. YINCAE will continue to serve and please the community as well as the customers. Customer satisfaction is the foundation of our company and YINCAE will continue ensure that every customer is more than satisfied with our product.
NEW ENCAPSULANT PRODUCT SERIES SOLVES THERMOCYCLING ISSUES
Jun 10, 2014 | (Albany, NY) June 10, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new encapsulant products that enable greater production temperature flexibility for microchips with different alloy applications.
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