News Releases from Tresky AG
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10 news releases added by Tresky AG
Company Information:
Tresky unveils the photonics bonder for sub-micron use in nano- and optoelectronics
Nov 27, 2023 | The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product, the highly precise photonics bonder. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
Tresky Automation launches new website
Nov 20, 2023 | The German DIE Bonder specialist is launching its brandnew website with a fresh corporate design for productronica 2023. The new website includes different focus and structure for the bonder solutions, which should help selecting proper information.
Fluxless soldering using formic acid vapor for optoelectronics
Nov 20, 2023 | Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several innovations in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.
Tresky unveils its latest breakthrough product at productronica 2023: the photonics bonder for sub-micron use in nano- and optoelectronics
Nov 20, 2023 | The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product the highly precise photonics bonder at productronica 2023 in Munich. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
Tresky presents metallic sintering for power electronics at productronica 2023
Oct 30, 2023 | Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
Tresky presents sintering as a future key technology at pcim EUROPE
May 03, 2023 | Tresky GmbH from Hennigsdorf near Berlin will present its newly developed pre-sintering processes at this year's pcim EUROPE in Nuremberg. As assemblies with high-performance semiconductors represent a key technology for the global energy turnaround and electromobility, Tresky has been working on these manufacturing processes for some time and will present further product and process innovations in 2023 as part of additional development steps.
Tresky Holds Successful Showing at iMAPS 2013, Appoints 3 New Reps
Oct 18, 2013 | Tresky announces that iMAPS The 46th International Symposium on Microelectronics, held in Orlando, FL from September 30-October 3, 2013, was a fruitful and exciting show.
Tresky Appoints NW Test Solutions Inc. as Its Newest Rep
Jun 25, 2013 | Tresky, announces that it has named NW Test Solutions Inc. as its newest rep, covering the Pacific Northwest.
Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics
Jun 20, 2013 | Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.
Tresky to Display T-6000 Die Bonder at SEMICON West 2013
Jun 20, 2013 | Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
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