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News Releases from Averatek Corporation

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8 news releases added by Averatek Corporation

Averatek Opens New Channels for Mina™ Surface Treatment

Mar 14, 2022 | Averatek is pleased to announce the addition of Jeff Berlin of TEC Associates to its marketing efforts. As a manufacturer's' representative, Berlin will be responsible for business development with Mina™, a surface treatment that enables soldering to aluminum. Replacing silver-based ACP (Anisotropic Conducting Paste) with solder, Mina™ offers more cost-effective and environmentally friendly manufacturing, with shorter processing times and reduced wet-chemistry steps.

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Jan 03, 2022 | Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Awarded for Breakthrough Aluminum Soldering Process

Nov 22, 2021 | Averatek is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Solder Paste for its new Mina™ chemistry. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during Productronica in Munich, Germany.

Averatek Wins Mexico Technology Award for New Aluminum Soldering Product

Nov 07, 2021 | Averatek is pleased to announce that it received a 2021 Mexico Technology Award in the category of Chemistries for its new Mina™ chemistry. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Oct 31, 2021 | Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek to Present "Reliability of Solder Joints on Flexible Aluminum PC Boards" at SMTAI

Oct 07, 2021 | Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."

Absolute EMS Is Averatek Approved

Aug 26, 2021 | Averatek is pleased to announce that Absolute EMS has implemented soldering to aluminum using Averatek's Mina™ chemistry. Absolute EMS assembles surface mount components onto polymer substrates with aluminum traces using Averatek's Mina™ pretreatment.

NexLogic Technologies, Inc. Implements Averatek's Breakthrough Aluminum Soldering Process

Jul 15, 2021 | Averatek is pleased to announce that NexLogic Technologies, Inc. has implemented soldering to aluminum using Averatek's Mina™ chemistry. Mina™ is a breakthrough new pretreatment that allows for soldering to aluminum as easily as to copper with significant benefits over traditional methods of soldering to aluminum.

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