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Amkor and STATS resolve patent infringement lawsuit

Sep 10, 2001

Amkor Technology Inc., Chandler AZ, and ST Assembly Test Services Ltd., Singapore, said today that they have amicably resolved the pending patent infringement litigation between the two companies.

Amkor had filed suit against STATS in February 2001 in the Eastern District of Texas, alleging infringement by STATS of United States Patent No. 6,143,981.

Today's settlement resolves the litigation in its entirety, the companies said. Amkor has granted STATS a non-exclusive license to practice the Amkor MicroLeadFrame patents. STATS has in turn agreed to provide Amkor perpetual worldwide immunity from suit based on STATS Quad Leadless Package technology.

Amkor's MLF and STATS' QLP are near chip scale plastic encapsulated packages with a copper leadframe.

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