SMT, PCB Electronics Industry News

BTU to Present Vacuum Reflow Data and Reflow Jump-Start at SMTAI

Oct 08, 2018

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, is pleased to announce that Fred Dimock, Manager of Process Technology, will present at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL

Dimock will present “Operation and Repeatability Testing of a Vacuum Reflow Oven with Preliminary Void Reduction Data” during Session MFX5, entitled “Reflow Technologies” on Wednesday, Oct. 17th at 1:30 p.m. Dimock also will participate in Session PDC2, entitled “Jump Start – a Free Introduction to SMT Process Basics and Troubleshooting” on Sunday, Oct. 14th at 8:30 a.m.

Dimock teaches numerous SMTA solder reflow classes and has participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. He wrote the chapter on solder reflow for the ‘Handbook of Electronic Assembly’ and ‘A Guide to SMTA Certification’ by Dr. Lasky and Jim Hall.

Dimock holds an Associate’s Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). He is a long-standing member of the SMTA Technical Committee.


BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

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