Dec 11, 2001
ViTechnology, LLC (Haverhill, MA) announces a new technology for soldering surface-mount assemblies, curing flip chip underfill and glob top encapsulation that offers savings in operating cost, footprint and downtime. The X-600 Phase Convection soldering system features a hermetically sealed loading system by which boards are loaded into one of four levels of phase convection. Each level is comprised of three phase units, each with its own conveyor where boards are heated while remaining static-improving temperature uniformity. Each phase unit has a re-circulating convection system in which the temperature is regulated by a pyrometer that measures the exact temperature of the board, not the surrounding air. These measurements can be monitored by an on-system SPC data collection tool. Once cooled, the board is transported onto the upstream conveyor by an identical unloading system.
The system measures 2.6 meters in length, the equivalent of an 8-10 zone reflow oven in a third of the footprint, with no reduction in throughput.
Because reflow occurs in a sealed environment, nitrogen consumption is reduced by up to 50 percent and flux management is greatly simplified. Re-circulating air from each phase unit passes through a flux management system on each level, which is connected to a closed-loop flux decontamination system, resulting in a self-cleaning oven. Total maintenance time for the system is less than five minutes per week. Cost of ownership is reduced by 50 percent. In addition, the system is environmentally friendly-no external exhaust is required exhaust-and meets ISO 9002 requirements.