Aug 09, 2012 The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.
During this year’s expo, the Capital Chapter will host a number of technical presentations.
Alan Hardy, Automotive, Electronics and Military Market Manager for Specialty Coating Systems, will present “Parylene Coating for Enhanced Reliability Electronics.” His lecture will range from a general overview of parylene coating to advanced applications.
Dr. Craig Hillman, CEO and Managing Partner of DfR Solutions, is an expert in best practices in Design for Reliability (DfR), Pb-free strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology (capacitors, resistors, etc.), and printed board failure mechanisms. During the Capital Expo, he will present “Design for Manufacturability” as this is considered a critical step in ensuring a successful new product introduction.
Additionally, Robert Simon, President and CEO of USTEK, Inc., will present a paper titled “PCB Heat Dissipation Options.” This presentation will touch on the basic theory of heat flow through a composite structure, how varying the elements will change the rate of heat transfer and the steady-state temperature gradient, and what performance and cost trade-offs will be encountered.
Your registration includes a complimentary lunch on the show floor as well as the opportunity to win various door prizes including three Kindles.
Please join us for this great networking and educational event. To register online, please visit
http://smta.org/chapters/chapters_detail.cfm?chapter_id=14.
If you are interested in exhibiting, please contact Seana Wall, SMTA, at 952-920-7682 or at seana@smta.org.
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