Aug 04, 2014 The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 2, 2014 as a focused symposium at SMTA International in Rosemont, Illinois.
In the first session, the A.R.E.A Consortium will present Material Evaluation for High Reliability Applications. The second session includes presentations related to On-Going, Lead-Free Research, Development and Knowledge Sharing Priorities. The third session of the symposium will address Tin Whisker Research and Mitigation. The fourth session will focus on Pb-free Solder Joint Reliability.
Papers will be presented from Alcatel-Lucent, Agilent Technologies, Binghamton University, Celestica, Hewlett Packard, IBM Corporation, iNEMI, Intel Corporation, Raytheon Corporation, Rockwell Collins, and Universal Instruments Corporation, among others.
Details of the Lead-Free Soldering Technology Symposium can be found at http://www.smta.org/smtai/symposium.cfm#lf or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or joann@smta.org.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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