SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference

SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference

Jan 30, 2019

The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.

Richard Coyle, Ph. D., Nokia Bell Labs and a team of co-authors from the iNEMI/HDPUG 3rd Generation Pb-Free Alloys Project won the Best of Proceedings category for the paper "Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys." David Hillman and co-authors from Collins Aerospace (formerly Rockwell Collins), came in second for the paper “Dissolution Rate of Specific Elements in SAC305 Solder.” Richard Coyle, Ph.D., Nokia Bell Labs, David Ihms, Ph.D., Delphi Technologies, and additional co-authors from the iNEMI QFN Board Level Reliability Project took third place for the paper “The Influence of Printed Circuit Board Thickness on the Thermal Fatigue of Quad Flat No-Lead Packages.”

The winner from SMTA International 2018 for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Kazuhiro Nogita, The University of Queensland, for the presentation entitled "The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates." The award is based on the conference attendees' rating of each speaker at the technical session.

Best Student Presentation was awarded to Vishnu Reddy, Georgia Tech, for his paper “Assessment of 2nd level interconnect quality in Flip Chip Ball Grid Array (FCBGA) Package using Laser Ultrasonic Inspection Technique.”

The authors will formally be presented their awards at the annual meeting and keynote session during SMTA International on September 22-26, 2019 in Rosemont, Illinois. For information on participating in the 2019 SMTA International Conference, visit the Call for Papers page at https://smta.org/smtai/call_for_papers.cfm. Abstracts can be uploaded directly on-line and will be accepted through March 1, 2019.

The papers are available in the conference proceedings available in the SMTA Bookstore at https://www.smta.org/store/book_store.cfm. The individual articles are available for SMTA members to download from the knowledge base.


For more information contact Tanya Martin: tanya@smta.org or 952-920-7682 or visit https://www.smta.org. The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Apr 23, 2019 -

eSMART Factory Conference Addresses New Processes and Systems for “Smart” Manufacturing

Apr 16, 2019 -

Medical Electronics Symposium Program Finalized

Mar 18, 2019 -

Cleveland Clinic and IBM to Keynote SMTA Medical Symposium

Mar 03, 2019 -

Seeking Student Applications for 2019 Grant and Scholarship Opportunities

Mar 03, 2019 -

SMTA Capital Chapter Tutorial – Supporting High Reliability at the OEM: A PCB Perspective

Feb 18, 2019 -

SMTA Announces 2019 Certification Program Offerings

Feb 09, 2019 -

Latest Conference Proceedings Now Available in SMTA Knowledge Base

Jan 27, 2019 -

Electronics in Harsh Environments Conference Program Announced

Dec 11, 2018 -

Fred Dimock, BTU International, to Present at SMTA Capital Chapter Meeting on January 10th

Nov 16, 2018 -

SMTA China Awards Megan Wendling Councilor of the Year 2018

618 more news from Surface Mount Technology Association (SMTA) »

Apr 25, 2019 -

Seamark Zhuomao show x-ray component counter in Nepcon China at April 24-26

Apr 25, 2019 -

How does constant temperature humidity test chamber work?

Apr 24, 2019 -

ESI Installs Kurtz Ersa Inc. Hybrid Rework System

Apr 24, 2019 -

CyberOptics Receives Two SMT China Vision Awards for MRS-Enabled Systems during NEPCON China

Apr 24, 2019 -

optical control receives SMT China Vision Award for component storage at NEPCON China

Apr 24, 2019 -

BTU Picks up Award for Aqua Scrub Flux Management Technology at NEPCON China

Apr 24, 2019 -

KYZEN Picks up Award for New AQUANOX A4727 Cleaner during NEPCON Shanghai

Apr 24, 2019 -

Thermaltronics Awarded for Full Vision Soldering Robot at NEPCON China

Apr 24, 2019 -

Metcal to Demo Its CV Soldering System at the SMTA Wisconsin Expo

Apr 24, 2019 -

East/West Manufacturing Partners with MIRTEC for Their 3D AOI Inspection Requirements

See electronics manufacturing industry news »

SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference news release has been viewed 116 times

  • SMTnet
  • »
  • Industry News
  • »
  • SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference
used pcb assembly equipment - lel semi

Led tester