The SMTA Capital Chapter is excited to host the first chapter webinar of 2021 on January20that11:00 AM EST.Fred Dimock, BTU International, will be presenting “Operation of a Vacuum Reflow Oven with Updated Void Reduction Data.”
This presentation is a sequel to the preliminary data Fred provided to the chapter in early 2019 and will include an overview of the vacuum reflow process and an explanation of why vacuum reflow is of interest to the electronic assembly industry. The presentation will discuss finalized data from the vacuum reflow void reduction experiment completed at the Universal Instruments Process Laboratory andresults from live demonstrations at ACI Technology. The live demonstrations will include reworked boards that had been previously processed without vacuum reflow and Fred will describe the refinements that have been made to subsequent vacuum furnaces.
Fred Dimock, Manager of Process Technology at BTU International,has extensive experience in thermal processing and has assisted many companies with process refinements over the years. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. He alsowrote the chapter on solder reflow for the “Handbook of Electronic Assembly and A Guide to SMTA Certification”by Dr Lasky and Jim Hall.He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.
Given these difficult times the Capital Chapter officer team is happy to provide this webinar to all attendeesFree of Charge.
To RSVP, please click here.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please visit www.smta.org.