Jul 30, 2009
The Evolving Technologies Summit will feature sessions with topics on Counterfeit Electronics, Nanotechnology, Advanced Packaging, and an International Panel will discuss and debate timely topics that include The Next 100 Years, "stretchable electronics", solar energy and extreme density electronics. A keynote presentation by Lee Smith, Amkor Technologies, on Interconnect Trends and Technologies in 3D Stacked Packaging will be featured at lunch.
The Contract Manufacturing Symposium includes sessions that will be beneficial to contract manufacturers, customers, investors, and anyone else that is interested in business issues for contract manufacturing. One session will focus on business opportunities such as solar, fuel cell and repair services. The second session will highlight management challenges such as ensuring efficient linkage in product development, addressing the challenge of counterfeit products, and exploring opportunities to expand into the solar energy market.
The renowned Lead-Free Soldering Technology Symposium will begin with an overview of Pb-free processing and reliability investigations underway at England's National Physical Laboratory (NPL). The second session will examine the performance variables of new Pb-free solder alloys. The ever-popular case studies session will follow the alternative alloys papers. Featured case studies describe the challenges facing producers tasked with implementing Pb-free solders on high-reliability assemblies having a high mix of component types. The symposium will conclude with a very interesting reliability session.
For full details and to register for SMTA International, visit http://www.smta.org/smtai or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or joann@smta.org.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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