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Kyzen to Bring Advanced Packaging Cleaning Chemistries to SEMICON West

May 31, 2014

MICRONOX® MX2302 Wafer Level Cleaning Solution

MICRONOX® MX2302 Wafer Level Cleaning Solution

Kyzen announces plans to exhibit in Booth #5752 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA. Company representatives will showcase Kyzen’s AQUANOX® A4638 Advanced Packaging Cleaning Chemistry and MICRONOX® MX2302 Wafer Level Cleaning Solution.

AQUANOX® A4638 removes flux residue from flip chip and low clearance components. A4638 rapidly removes water soluble polar flux residues and exhibits a low surface tension. Incorporating Kyzen’s inhibition technology, A4638 offers exceptional material compatibility and is a non-hazardous, biodegradable aqueous solution containing no CFCs or HAPs.

MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. Effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems, MX2302 is compatible with all soldering materials and metal layers.

AQUANOX® A4638 and MICRONOX® MX2302 are available in one, five and 55 gallon containers. Additionally, Kyzen offers a full line of precision cleaning chemistries that meet any cleaning challenge.

Kyzen®, AQUANOX® and MICRONOX® are registered trademarks in the United States and other countries.


Kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. Kyzen’s industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. Founded in 1990, Kyzen is the leading provider of environmentally responsible, RoHS compliant cleaning chemistries to industries worldwide. For more information, please visit www.kyzen.com.

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