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Indium Corporation Announces Low-Temp Solder Webinars

May 12, 2020

Indium Corporation’s Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company’s innovative low-temperature solder offering on May 12 at 2 p.m. and May 13 at 8 a.m. EST.

Low-temperature soldering is not a “one alloy fits all” solution. Depending on the application, the actual temperature required for low-temperature soldering can vary widely. In Low-Temperature Solder Innovation — Durafuse™ LT and the Low- to Mid-Temperature Space, Hotvedt will examine Durafuse’s ability to bring mid-temperature drop shock properties into the upper edge of the low-temperature space, as well as low-temperature solder’s specific process limitations and lifetime requirements.

Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at

To register for the May 12 webinar, click here. Registration information for the May 13 webinar can be found here.

Hotvedt is responsible for facilitating the transition of new solder paste products from developmental stages into fully launched and marketable solutions. She also oversees product characterization and creation of marketing material to assist the sales team.Prior to joining Indium Corporation in 2018, Hotvedt held two engineering positions—one at Orthogonal, Inc. and one at Bristol-Myers Squibb. She was also an Indium Corporation Summer Intern in 2014. 

To register for Hotvedt’s webinar, visit The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to avoid Indium Corporation’s spam filters. This is a first come, first served event.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin 

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