SMT, PCB Electronics Industry News

Indium Corporation Expert to Host Power Electronics Webinar

Jun 18, 2020

Indium Corporation’s Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation’s InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.

Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. An uneven bondline can result in early cracking and solder layer delamination due to stress concentration at the thinner joint areas. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Vijay will examine how InFORMS®, a reinforced matrix solder composite preform (and patent-pending ribbon), deliver uniform bondline control and enhanced reliability by a factor of 2X while achieving the lowest cost of ownership. A live question and answer session will follow the presentation.

Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform.

To register for Vijay’s webinar, visit The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to ensure Indium Corporation’s security measures don’t filter messages into spam folders. This is a first-come, first-served event.

Vijay is responsible for technology programs and technical support for customers in Europe, Africa, and the Middle East. Previously, he was based in San Jose, California and was responsible for applications support for customers on the North American West Coast. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics with a focus on the use of different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials.

He joined Indium Corporation in 2003 and has more than 20 years of experience in electronics assembly. Vijay has a master’s degree in industrial engineering with a specialization in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

Jul 07, 2020 -

Indium Corporation Announces Spanish-Language Low-Temperature Solder Webinar

May 12, 2020 -

Indium Corporation Announces Low-Temp Solder Webinars

Jan 10, 2020 -

Indium Corporation’s Vareha-Walsh to Share Insights at World Congress of Smart Materials 2020

Nov 12, 2019 -

Indium Corporation’s Industry Partners to Feature ‘Live@Productronica’ Demonstrations

Apr 23, 2019 -

Indium Corporation Launches IndiTri™—High-Purity Indium Trichloride

Apr 17, 2019 -

Indium Corporation Earns International Automotive Quality Recognition at Solder Manufacturing Facilities

Apr 15, 2019 -

Indium Corporation Features New InFORMS® Solution for Die-Level Bonding at PCIM 2019

Apr 14, 2019 -

Indium Corporation’s Vareha-Walsh to Present at SVC TechCon

Mar 18, 2019 -

Indium Corporation Celebrates 85 Years of Technology Innovation and Growth

Feb 09, 2019 -

Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019

272 more news from Indium Corporation »

Jul 09, 2020 -

Austin American Technology and AVANT Technology Partner for Advanced Stencil Cleaning

Jul 09, 2020 -

Specialty Coating Systems to Host New Webinar: "Advanced Coating Technologies for IoT Sensors in Harsh Environments"

Jul 09, 2020 -

Improve Process Control with Seika's SWB Wetting Balance Tester by Malcom

Jul 09, 2020 -

TRI won two EM Asia Innovation Awards for AOI and ICT

Jul 09, 2020 -

CyberOptics Unveils WX3000™ Metrology and Inspection System for Semiconductor Wafer-Level and Advanced Packaging at Virtual SEMICON West

Jul 09, 2020 -

BTU to Participate in SEMICON West Virtual Event

Jul 09, 2020 -

Lockheed Martin Chooses Austin American Technology for Cleaning Needs

Jul 09, 2020 -

SMTA Welcomes New Board Members

Jul 09, 2020 -

V310i The Advanced 3D Solder Paste Inspection Solution for Your SMT Inspection Needs

Jul 07, 2020 -

Indium Corporation Announces Spanish-Language Low-Temperature Solder Webinar

See electronics manufacturing industry news »

Indium Corporation Expert to Host Power Electronics Webinar news release has been viewed 114 times

Selective Conformal Coating System - GPD SimpleCoat

Flux-Free Reflow Soldering