Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSWAutomation for use with their newest microfluid dispenser, SD1.
The SD1Automated Intelligent Micro-dispenserdispenses at a minimum of 80µm, the smallest solder dot in the world, with gaps as small as 20µm, while downsizing the equipment footprint up to 48%. Thanks to the development effort between the two companies, Indium12.8HF is the recommended product to be used on this system to achieve those fine dots and lines. This no-clean, halogen-free solder paste helps deliver exceptional microdispensing performance in standalone applications, such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield-attach, and microBGA. It also complements the stencil printing ofIndium Corporation’s best-selling solder paste, Indium8.9HF.
“This is an exciting time for our friends at NSW Automation and for us as well,” said Kenneth Thum, Senior Area Technical Manager at Indium Corporation, who has been working with NSW Automation on the fine-feature dispensing projects. “As more applications begin to adapt finer pitches and smaller packages, it’s critical that we deliver reliable equipment and materials that provide solutions to today’s challenges.”
- Offers a flexible metal load (78-85%) to provide optimal dispensability
- Fine-powder adaptability: Type 5, Type 6, Type 7
- Has a clear residue with minimal flow-out
- Significantly reduces head-in-pillow (HIP)
- Eliminates or significantly reduces graping
- Minimizes reflow spatter
To learn more about Indium Corporation’s new jetting and microdispensing paste, visithttps://www.indium.com/products/solders/solder-paste/jetting-and-microdispensing.
To learn more about NSW Automation’s SD1, visit https://www.nswautomation.com/NSW/sd1-micro-fluid-dispenser/.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
NSW Automation is renowned for creating the world's smallest solder paste microdispensing of dots and lines size as small as 80µm which are extremely demanding for SMT miniaturization and today's microelectronics packaging industry, such as 5G devices, MEMS, 3D-SiP or PoP packages, even active and passive components like 01005 and 008004 assemblies in hybrid SMT assembly process. They are one of the leaders in the field of precision fluid microdispensing systems. They cover a variety of materials from flux and solder paste to materials such as conductive silver epoxies, UV adhesives, silicone gel, etc.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.