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Indium Corporation Expert to Present for IEEE EPS Webinar Series

Dec 10, 2020

Indium Corporation’s Dr. Hong Wen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the IEEE Electronics Packaging Society (EPS) Malaysia Chapter Webinar Series at 9 a.m. Malaysia Time, Wednesday, Dec. 16 (8 p.m. Eastern Time, Tuesday, Dec. 15).

Lead-free solder alloys have been prevailing in the electronics industry for more than a decade due to the worldwide push for “green” manufacturing. As the electronics industry continues to advance rapidly toward miniaturization, two important drivers dictate the evolution of lead-free solders. In Evolution of Lead-Free Solder Alloys, Dr. Zhang will examine how the need for low-cost, high-reliability options have inspired the continued evolution of lead-free solders.

To register, please visit https://bit.ly/37s9Jrt.

Dr. Zhang is Manager of the Alloy Group in Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-temperature and high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control the joint’s morphology, thus improving the reliability. On the basis of this technique, the Durafuse LT, BiAgX®, and Durafuse HT solder systems were invented to meet the market need. He has published more than 20 papers and journal articles. Dr. Zhang received his PhD in material science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D.


Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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