Jan 23, 2001 IPC- Association Connecting Electronics Industries has recognized the winners of this year's Best U.S. and International Paper awards at IPC SMEMA Council's Electronics Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA.
Brian Smith, from Siemens Energy and Automation (EAE) Group in Atlanta, GA, received the award for Best U.S. Paper for Initial Characterization of High Yield 0201 Processing.
Steve Harris, from Solectron Corporation in Dunfermline, Scotland, accepted the Best International Paper award on behalf of a consortium, including Solectron Scotland, Alcatel Microelectronics, Alcatel Space Industries, Alcatel Bell, IMEC/TFCG, Thomas Walter and TUB (University of Berlin) for Standard SMT Process for Flip Chip Assembly on FR4 Substrates.
IPC awarded each winner with a $1,000 in cash and a commemorative plaque.
APEX has been organized by the IPC SMEMA Council in response to an industry need for a trade show that is cost-effective and fair for exhibitors, and highly focused on the products and technology of the electronics assembly industry. This approach, coupled with a premier conference program, organized by the industry, delivers the most attractive package to exhibition visitors. APEX features all segments of the electronics assembly industry, from bare boards to tested assemblies, and is the only show in North America that showcases machinery from every major pick-and-place equipment manufacturer.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its more than 2,700 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $44 billion US industry employing more than 400,000 people.
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