Oct 20, 2016 Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Session 4 on Thursday, October 27th will focus on “Ultra-Thin or Nanocoatings in Electronics Assembly Operations.”
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Amanda Rickman, Process Engineer at Rockwell Collins, will focus on conformal coating for Class 3 hardware.
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Kailey Bradt, Chemical Engineer at Dry Wired, will focus on optimization of industrial process parameters for Ultra-Thin Film Nanocoatings.
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Dave Hillman, Principal Materials & Process Engineer at Rockwell Collins will focus on the impact of improper conformal coating processes on Lead-free BGA solder joint integrity.
Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference. The link http://www.ipc.org/calendar/2016/cleaning-coating/agenda.htm provides a detailed conference agenda.
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