SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions

Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions

Jan 12, 2019

IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

A panel of industry experts rated and scored each product and assigned a numerical value to each submitted product based on the following criteria: How is this product innovative? How is this product changing the manufacturing industry? What value will customers experience with this new product?

The IPC APEX EXPO Best of Innovation Awards will be presented on Tuesday, January 29 during the opening keynote to the following companies:

  • GreenSource Fabrication LLC for their printed circuit board fabrication facility, the only fully automated and "green" PCB fabricator of its kind. All chemicals and water are reclaimed and reused, and the facility’s daily water consumption is 500 gallons regardless of factory load.

  • Meyer Burger (Netherlands) BV for an inkjet printer for PCB soldermask. This novel inkjet-printed solder mask solution for PCBs, combines a dedicated production inkjet printing system based on Meyer Burger’s PiXDRO product line, Agfa’s unique DiPaMat solder mask ink, and advanced printing strategies for optimized layer deposition.

  • Nordson DAGE for Explorer one, an entry level, operator controlled, manual X-ray inspection (MXI) system for checking manufacturing quality in electronics assemblies. Common manufacturing defects such as open or bridged solder connections, BGA reflow quality and voiding can be checked quickly and easily on a high mix of product types across a PCB.

  • Henkel Corporation for its LOCTITE ECCOBOND UF 1173, a novel underfill that can withstand harsh environments and the elevated operating temperatures inherent with smaller, higher-functioning devices. In addition to its performance benefits, the product prioritizes health and safety.

  • Vayo (Shanghai) Technology Co., Ltd. for its DFM Expert v5, a unique 3D DFA/DFM solution for electronics manufacturing.

“The IPC APEX EXPO Innovation Awards allow us to celebrate the innovators and forward thinkers who are changing the technological landscape of the electronics industry,” said John Mitchell, IPC president and CEO. “This year, product and service submissions were certainly innovative and the companies did an exceptional job in identifying their product’s unique value in the industry. The innovative submissions directly indicate the strength of the electronics industry and its ability to respond to new challenges resulting from emerging technologies in the electronics marketplace,” Mitchell added.

Members of the award review board include: Dave Geiger, Flex; Don Dupriest, Lockheed Martin Missiles & Fire Control; Carsten Salewski, Viscom Inc.; Martin Goetz, Northrop Grumman Corporation; and Terry Kocour, Lockheed Martin Corporation.


For more information on all IPC APEX EXPO activities, visit www.IPCAPEXEXPO.org. IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,900 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Jul 18, 2019 -

Meet KYZEN in Mexico at the SMTA Queretaro Expo

Jun 30, 2019 -

David Adams, Collins Aerospace, Earns Dieter Bergman IPC Fellowship Award at IPC SummerCom

Jun 26, 2019 -

IPC Commends US EPA Proposal to Reduce Reporting Burden on Byproducts Sent for Recycling; Seeks Clarifications in Final TSCA CDR Rule

Jun 26, 2019 -

Volunteers Honored for Contributions to IPC and the Electronics Industry Committee Awards presented at IPC SummerCom

Jun 26, 2019 -

Help Build the Industry’s Future: Become and IPC Emerging Engineer or Mentor IPC now accepting applications for 2020 program

Jun 26, 2019 -

U.S. House Approves Measure to Promote R&D on Lead-Free Electronics in Aerospace, Defense, Automotive, Medical Sectors

Jun 09, 2019 -

New U.S. Tariffs on Mexican Imports Would Harm U.S. Electronics Companies and Their Customers

Jun 02, 2019 -

New U.S. Tariffs on Mexican Imports Would Harm U.S. Electronics Companies and Their Customers

Jun 02, 2019 -

North American PCB Sales and Orders Continue to Outpace 2018 IPC Releases PCB Industry Results for April 2019

Jun 02, 2019 -

MarVac Assemblies Earns IPC Qualified Manufacturers Listing (QML)

1018 more news from Association Connecting Electronics Industries (IPC) »

Jul 21, 2019 -

The Murray Percival Company Announces End of Summer Inspection Sale

Jul 21, 2019 -

KIC to Showcase Reflow Process Inspection with i4.0 Real-time Data Connectivity

Jul 19, 2019 -

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Jul 18, 2019 -

Data I/O Expands Sales Representation with Assembly Products LLC

Jul 18, 2019 -

Meet KYZEN in Mexico at the SMTA Queretaro Expo

Jul 18, 2019 -

James Holava Joins CheckSum as Director of Sales

Jul 18, 2019 -

Saki Corporation and Cogiscan Announce Strategic Partnership Collaboration Speeds Development of Smart Factory Solutions

Jul 18, 2019 -

Data I/O Announces Michael Tidwell as Vice President of Marketing and Business Development

Jul 17, 2019 -

Ersa to Discuss High-Performance Wave Solder System with Solder Bath Technology

Jul 17, 2019 -

Future-Oriented Investment in High-Quality X-ray Tubes

See electronics manufacturing industry news »

Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions news release has been viewed 166 times

  • SMTnet
  • »
  • Industry News
  • »
  • Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions
TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit

Flying Probe Probe Tester with AOI