Feb 18, 2020 IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
The Electronics Materials Forum will focus on developments in materials and processes associated with advanced electronics assembly and manufacturing. The content will focus on emerging technologies challenging existing material sets for board fabrication, assembly, and post-assembly protection.
Expert technical presentations are being sought in the following areas:
Substrate materials:
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Novel board laminates
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Surface finishes
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Solder mask advancements
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Flexible/wearable circuits
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HDI developments
Assembly materials:
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New solder alloys
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Flux development
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Cleaning chemistries
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Assembly process strategies
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Thermal interface solutions
Protective materials:
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Cleaning chemistries
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Conformal coatings
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Adhesives
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Underfills
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
Technical conference paper abstracts and course proposals are due February 27, 2020. To submit an abstract or course proposal, contact Brook Sandy-Smith, IPC technical conference program manager.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,800 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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