SMT, PCB Electronics Industry News

IPC Issues Call for Participation for IPC APEX EXPO 2021

Mar 08, 2020

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.         

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper.”                                               

Topics for Technical Conference Papers and Professional Development Courses:

  • 3D Printing in Electronics Manufacturing
  • Automation in Electronics Manufacturing
  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201 Metric
  • Assembly and Rework Processes
  • BGA/CSP Packaging
  • Black Pad and Other Board Related Defect Issues
  • BTC/QFN/LGA Components
  • Business & Supply Chain Issues
  • Cleaning
  • Conformal Coatings
  • Corrosion
  • Counterfeit Electronics
  • Design
  • E-textiles
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Electromigration
  • Electronics Manufacturing Services
  • Graphene in Electronics Manufacturing
  • Lean Six Sigma
  • LED Manufacturing
  • Failure Analysis
  • Flexible Circuitry
  • HDI Technologies
  • Head-on-Pillow
  • Board and Component Warpage
  • High Speed, High Frequency & Signal
  • Industry 4.0
  • Integrity
  • Lead-Free Fabrication, Assembly & Reliability
  • Miniaturization
  • Nanotechnology
  • Optoelectronics
  • PCB Fabrication
  • PCB and Component Storage & Handling Performance
  • Quality & Reliability
  • Packaging & Components
  • Photovoltaics
  • PoP (Package-on-Package)
  • Printed Electronics
  • Reshoring
  • RFID Circuitry
  • Robotics
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • 2.5-D/3-D Component Packaging
  • Underfills
  • Via Plugging & Other Protection
  • Wearables

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.                                             

Technical conference paper abstracts are due June 20, 2020 and course proposals are due June 8, 2020. To submit an abstract or course proposal, visit www.ipcapexexpo.org/education/call-for-participation.

For more information on technical conference or professional development course participation, contact Brook Sandy-Smith, IPC technical education program manager at BrookSandy@ipc.org.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,800 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Mar 26, 2020 -

IPC Encouraged as U.S. EPA Eases Up on TSCA Fees

Mar 26, 2020 -

North American PCB Industry Sales Down 1.1 Percent in February

Mar 26, 2020 -

IPC Welcomes U.S. Economic Stabilization Package, Proposes Agenda for Economic Recovery and Resiliency in Electronics Manufacturing

Mar 25, 2020 -

IPC Releases Automotive Addendum, IPC J-STD-001GA/IPC-A-610GA

Mar 14, 2020 -

Electronics Manufacturers Feel Impact of Coronavirus Disruptions But Majority Expect Business to Return to Normal by Summer 2020

Mar 12, 2020 -

Precisionworks/Condunet Earns a Qualified Manufacturers Listing for IPC/WHMA-A-620

Mar 12, 2020 -

Fabrication Technologies Inc./IGM Solutions Earns Qualified Manufacturers Listing to IPC J-STD-001 and IPC-A-610

Mar 08, 2020 -

IPC Releases New Standards Revisions

Mar 08, 2020 -

Taiwan Union Technology Corporation is First to Pass Recertification Under IPC-4101 Qualified Products Listing

Mar 08, 2020 -

Electronics Industry Elevates its Excellence at IPC APEX EXPO 2020

1096 more news from Association Connecting Electronics Industries (IPC) »

Mar 26, 2020 -

IPC Encouraged as U.S. EPA Eases Up on TSCA Fees

Mar 26, 2020 -

North American PCB Industry Sales Down 1.1 Percent in February

Mar 26, 2020 -

Austin American Technology NanoJet Inline Cleaners Help Reduce Consumption with Integrated Water Recycling

Mar 26, 2020 -

IPC Welcomes U.S. Economic Stabilization Package, Proposes Agenda for Economic Recovery and Resiliency in Electronics Manufacturing

Mar 26, 2020 -

Virtual Industries' 220 V AC ADJUST-A-VAC® ESD-Safe Kit With Foot Switch, ESD-Safe Delrin Small Parts Tips

Mar 26, 2020 -

Award-Winning Kodiak Assembly Solutions Remains Open

Mar 25, 2020 -

Southern California PCB Manufacturer Working Hard to Support Production of Ventilators

Mar 25, 2020 -

BOSCH SELECTS MIRTEC AS STRATEGIC 3D AOI PARTNER FOR CONTINUOUS QUALITY IMPROVEMENT

Mar 25, 2020 -

PVA Manufactures COVID-19 Emergency Ventilator

Mar 25, 2020 -

SMTA Releases Selective Soldering 101 Online Training Course

See electronics manufacturing industry news »

IPC Issues Call for Participation for IPC APEX EXPO 2021 news release has been viewed 18 times

Fluid Dispense Pump Integration

Selective Conformal Coating System