Jul 20, 2010
BANNOCKBURN, IL — Collaborating to offer an unmatched regional event for companies and their employees, IPC — Association Connecting Electronics Industries® and Canon Communications are bringing the best of the global electronics manufacturing industry together at Electronics Midwest, September 28–30, 2010. Taking place at the Donald E. Stephens Convention Center in Rosemont, this premier event will feature an exhibition as well as an IPC technical conference on electronics sustainability, workshops on new standards and assembly materials, and IPC standards development meetings. The conference and workshops will present fresh ideas and cost-effective solutions to companies in the electronics assembly and printed board design and manufacturing industries. Online registration is now available at http://www.ElectronicsMidwest.com/register.
The industry’s top suppliers will showcase their newest products, processes and emerging technologies in all major categories of electronics manufacturing, from adhesives, coatings, chemicals and materials to test, inspection and measurement equipment and services. Back by popular demand, the EASi (Electronics Assembly Suppliers’ Initiative) Line will return to the show floor. The equipment on this live working assembly line will demonstrate state-of-the-art surface mount and through hole assembly, while on-site experts detail the line’s processes and equipment.
In addition to the state-of-the-art exhibition, Electronics Midwest will offer attendees free access to IPC’s opening session, Designing Electronics for Tomorrow and Manufacturing with Sustainability in Mind, presented by Carol Handwerker, Sc.D., Reinhardt Schuhmann Jr. Professor of Materials Engineering, Purdue University. Other free activities hosted by IPC include an “Ask the Experts” free forums covering challenges in printed board fabrication and assembly and a First-Timers’ Welcome Breakfast.
IPC will host a three-day technical conference on electronics sustainability; five professional development workshops; certification programs for EMS program managers and PCB designers and more than 70 standards development meetings. To view all IPC programs at Electronics Midwest, visit http://www.ElectronicsMidwest.com/IPC-programs-overview.
Registration to the exhibition is free to qualified pre-registrants or $55 on-site. In addition, registrants can save 20 percent on all fee-based activities if they register before August 27, 2010. A variety of registration options to meet individual educational and informational needs is available at http://www.ElectronicsMidwest.com/reg-options.
The Electronics Midwest exhibit hall pass will also offer free access to a number of co-located events, including Medical Design & Manufacturing (MD&M) Midwest, Design & Manufacturing Midwest, Assembly & Automation Technology Expo, PLASTEC Midwest and Green Manufacturing Expo.
To register for Electronics Midwest or to view complete show details, visit http://www.ElectronicsMidwest.com.
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About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.
Canon Communications LLC (www.cancom.com) is the leading producer of face-to-face, digital, print, and online business acceleration products for the world’s $3 trillion advanced, technology-based manufacturing industry, including medical device, packaging, design engineering, process technology, automated assembly, electronics, quality control, and plastics processing.
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