Palomar's Gold Connection provides a complete solution for gold bump, flip chip applications using solderless interconnect technologies. The Gold Bumper� produces bumps on either wafers or singulated die. The Flip Chip TCB� (Thermocompression Bonder) provides die flip and attach capability for small or large volume production.
Winning products are selected based on technological innovation, design, usefulness, and response from Fiberoptic Product News readers and editors. Fiberoptic Product News (FPN), a Reed Business Publication, is the global source for fiberoptic technology and applications and has 37,000 readers.
The award was presented at the Optical Fiber Conference (OFC) in Atlanta, GA on March 24, 2003. Winners were selected from the more than 2000 new products that appeared in Fiberoptic Product News in 2002. After a vote by the 37,000 FPN readers, the top fifty were reviewed by FPN editors, who chose 24 nominees in six product categories. Final voting took place via the Internet on the FPN web site.
"This is a confirmation of the excellence of the Gold Connection Flip Chip Bonding System by both the editors who select and write about innovative products in the optoelectronics field and the technical community who purchase and use optoelectronic products," said Bruce Hueners, Palomar's vice president of marketing.
"The Gold Connection is an integrated solution that addresses the industry's growing need for increased package density, reliability, and signal performance, while providing a clean, environmentally safe alternative to lead-based processes," Hueners added.
About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, medical, and life sciences industries.
Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices. Palomar's Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. Visit our web site at http://www.palomartechnologies.com or contact us at 760-931-3600.