Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging.
The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the ﬁrst machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.
FOX2 has a machine footprint of just 1m2 and can accept PCB sizes up to 16 x 12". Components with sizes from 01005 up to 1.3 x 3.1"are placed. The machine achieves 7,500 cph (IPC9805A) at 50 µm, 3 sigma with a two nozzle head.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
Essemtec AG is a privately held Swiss equipment manufacturer, specializing in high speed fluid dispensing as well as flexible high-mix SMT placement solutions. Both divisions leverage the company’s vast equipment and process know-how gained since 1991 to let their customers achieve significant competitive advantages. The company’s goal is to improve its customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMT storage. For more information about Essemtec, visit www.essemtec-usa.com.