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New, Large Capacity, Ultra-High Resolution X-Ray Inspection System.

Jul 25, 2002

Glenbrook Technologies Inc., a leading supplier of Real-time X-ray Inspection Systems to the electronic fabrication and semiconductor assembly industries has announced the availability of a newly developed large capacity, ultra-high resolution X-ray inspection system, "Oversized" Jewel box 90-C. The system facilitates x-ray inspection of larger assembled printed circuit boards (PCBs) up to 18" x 24". The system's high-voltage, 90kV, 4 micron focal spot X-ray tube allows magnifications of greater than 3000X, making it ideal for inspecting microBGA, Flip Chip and CSP packages. A precision 5-axis positioner permits full scanning of a 17" x 17" area with complete 360 degree rotation of boards up to 16" x 16".

Included with the system is, Glenbrook's GTI-5000TM advanced image processing software, which runs on a WindowsTM 2000 platform. Additional software enhancements include BGA Analysis, Void Measurement and Wire Sweep Measurement tools.


Glenbrook Technologies' proprietary X-ray inspection systems are used by electronics manufacturers and assemblers worldwide, in both laboratory and production settings, to verify the integrity of hidden solder joints for BGA's, as well as other sophisticated electronic packaging technologies.

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