Jul 29, 2002 Glenbrook Technologies Inc., a leading supplier of Real-time X-ray Inspection Systems to the electronic fabrication and semiconductor assembly industries has announced the availability of their training publication, "Rapid and Effective X-ray Inspection of BGAs, Using Signature Identification."
In addition to the step by step guide to the interpretation of BGA x-ray images, this presentation contains two actual x-ray movies of the solder reflow of a BGA, revealing the different stages of reflow, as they are taking place. (These unique movies were obtained using Glenbrook's patented "X-ray Guided Rework" technology US Patent 6009145).
This CD is an essential operator training guide for the effective understanding and interpretation of BGA reflow x-ray images and is available from Glenbrook Technologies for $ 55.00.
