SMT, PCB Electronics Industry News

Orbotech Announces New President

Jan 27, 2003

A Circuits Assembly News Item

Orbotech Inc. (Billerica, MA) has announced the appointment of Barry Cohen as president and chief executive effective January 1, 2003.

Cohen joined Orbotech, Inc. in 1994 as Eastern Region Manager. He was later promoted to vice president of sales, PCB Division and most recently held the position of vice president of electronics sssembly.

Cohen replaces Shabtai Shaanani, who successfully completed his 3-year assignment with the company.

Orbotech Ltd. (Yavne, Israel) also announced the introduction of new inspection capabilities for its line of automated optical inspection (AOI) systems to provide defect detection for connector pins and surface-mount components on backplane assemblies.

�Backplanes are complex products comprised of different interconnection technologies including soldered surface mount devices (SMD) and press-fit connectors,� said Shavi Spinzi, director of marketing, electronics assembly. �The different assembly steps and sheer number of press-fit connectors and pins on a backplane assembly lead to many opportunities for defects which are extremely difficult to detect with manual visual inspection and also present a particular challenge for conventional post-solder AOI systems.�

Orbotech's new backplane inspection capability provides automated inspection of common press-fit connector defects including missing and displaced pins. Due to their different electrical role, press-fit connectors also house pins of different lengths. To ensure that the pins protrude at the right distance from the connector, the new solution offers a pin height measurement capability, which utilizes the AOI system's angled cameras to report if the pin height is within a user-set tolerance. Additionally, the system has the ability to accurately inspect for pin tip and SMD component defects in one inspection cycle, versus the two cycles typically required. The AOI system uses its Z-axis to automatically adjust the height of the backplane assembly to bring the different inspection planes into focus under the system's multi-angled cameras.

www.orbotech.com

Mar 08, 2017 -

Orbotech’s SPTS Technologies Accelerates Industry Adoption of its Mosaic Plasma Dicing Solution with Order from JCAP Corporation

Jul 03, 2003 -

Orbotech Receives Major Order from Leading Taiwanese LCD-TFT Manufacturer

May 13, 2003 -

Orbotech Announces First Quarter 2003 Results

Mar 21, 2003 -

Orbotech S.A. Announces Change in Management

Mar 12, 2003 -

Orbotech Introduces Spiron-8800(tm)AOI Series for PCB Production

Feb 07, 2003 -

Orbotech Announces Fourth Quarter and Full Year 2002 Results

May 06, 2002 -

Orbotech Announces First Quarter 2002 Results

Feb 07, 2002 -

Orbotech Announces Three Technology Investments

Nov 12, 2001 -

Giga-Byte Selects Orbotech AOI Systems; Post-Solde

Aug 14, 2001 -

Orbotech Introduces New Website At www.orbotech.com

Jan 20, 2021 -

HZO Hosts "Risk, Reliability & Revenue: The Business Case for Protective Nanocoatings" Webinar

Jan 19, 2021 -

The principle of plasma surface treatment

Jan 19, 2021 -

New Yorker Electronics Releases Expanded VPG C4A Series Stress Analysis Strain Gage Sensors

Jan 17, 2021 -

IPC-DPMX import in upcoming Integr8tor and UcamX releases

Jan 17, 2021 -

Kodiak Assembly Solutions Profiled by Austin Business Journal

Jan 17, 2021 -

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Jan 17, 2021 -

Altus Enters a New Partnership with Two Market Leading Equipment Manufacturers

Jan 17, 2021 -

Plasmatreat Opens Subsidiary in Switzerland

Jan 17, 2021 -

PRIDE Industries Achieves International Traffic in Arms Regulations (ITAR) Registered Manufacturer Status

Jan 17, 2021 -

Murray Percival Co. Appoints Business Development Manager

See electronics manufacturing industry news »

Orbotech Announces New President news release has been viewed 332 times

Flexible high speed pick & Place

Your 2021 Eptac IPC Training Schedule