Mar 18, 2014 Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that Hiroshi Yamazaki, Assistant Manager at Hioki E.E. Corporation, will present during the APEX 2014 Technical Conference Session Test II on Thursday, March 27, 2014 from 10 a.m.-12 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.
Mr. Yamazaki will present “SJIT, Solder Joint Integrity Test, to Find Latent Defects in Printed Wiring Board Assembly,” which will discuss increasing test capability and decreasing test development time-important requirements for many products. Methods of expanding test capability in printed circuit board assembly and functional tests using new tools and test methods will be discussed in this session.
Born in Nagano, Japan, Mr. Yamazaki received a B. Eng. Degree in electrical engineering from Tokyo University of Science in 1988. He joined HIOKI E.E. CORPORATION in Japan in 1988 and has been engaged in the development of LCR meters and arbitrary waveform generators. He has also been responsible for designing measurement circuitry of automated test equipment. Beginning this month, he will be part of a new group at Hioki called the Market Intelligence Division.
For more information about Seika Machinery, visit www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
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