Seika Machinery, Inc. is pleased to introduce the Sawa SC-BM500E Automatic Ultrasonic Stencil and Screen Cleaner. The system is specifically designed for high-density SMT applications.
The Sawa SC-BM500E offers precise cleaning with an ultrasonic Cleaning head designed for a variety of applications, including wafer bump and electroform stencils.
It accommodates a wide range of stencils from 320mm×320mm to 1000×740mm, and is ideal for customers using multiple types of stencils and screens.
The SC-BM500E is available in three models to accommodate specific customer needs and is capable of cleaning inks, adhesives and solder paste from fine pitch apertures. To view demo video, visit https://www.youtube.com/watch?v=SeldBG_qy1s.
For more information, contact Michelle Ogihara at 310-540-7310; e-mail email@example.com; or visit www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.