At the heart of the DEK exhibit is the Horizon print platform – arguably the world’s most cost-effective and in-field adaptable mass imaging series. Being showcased at Nepcon Shanghai with newly designed cover packages which enhance usability and operator management, Horizon platforms feature fast changeover, 6-Sigma performance, scalability and easy in-field upgradeability as standard. Customers can determine the Horizon model that best suits their manufacturing requirements today, with the option to add advanced capabilities as manufacturing needs change.
DEK’s Nepcon Shanghai booth will feature three pre-configured Horizon platforms – the cost-effective Horizon 03iX, demonstrating high throughput materials deposition with PumpPrinting; the enhanced throughput Horizon 02iX, showcasing adhesive dispensing; and the highest throughput Horizon APiX, demonstrating advanced solder paste printing with exceptional accuracy and repeatability. The DEK team will also be on hand to talk to visitors about the company’s new Sentinel Photon platform. A complete print process safeguarding and control tool with 100% post-print inspection at full line speed, Sentinel isolates bad boards in real time without adversely impacting the production pace. Add to this the ability to incorporate full input and output verification along with sophisticated Verification and Traceability tools, and Sentinel moves the print process ever closer to a true “hands off” operation.
Visitors to booth 1E08 will also be able to see a wide range of DEK Productivity Tools on display, including ProFlow® ATx enclosed head print system. Incorporating a low-volume print chamber with an innovative paste loading mechanism for filling of the transfer head, ProFlow ATx delivers consistent and robust process control and performance - reducing cost and lowering material waste. Other Productivity Tools on show will include the multi-award-winning Cyclone understencil cleaner designed to cut conventional cleaning times in half, HD Grid-Lok® automated high density tooling, HawkEye® high-speed print deposit verification system, Over Top Snuggers high performance substrate clamping technology and Paste Roll Height Monitor, an easy-to-use tool designed to eliminate defects and improve end-of-line yield.
DEK will also be using Nepcon Shanghai as a forum to demonstrate the power of its VectorGuard® stencil solutions. A reusable, recyclable tensioning system prioritising operator safety, system rigidity and ease-of-use, VectorGuard is proven in use around the world. From the original, stainless steel VectorGuard Blue through to the electroformed nickel VectorGuard Gold for exceptional aperture wall definition and superior printability, the system is available in a wide range of foils to meet a variety of manufacturing challenges. Booth 1E08 will also highlight a selection of DEK’s Process Improvement Products including Understencil Cleaning Rolls and Understencil Cleaning Agents, each designed to boost productivity and yield, reduce risk of defects and minimize rework.
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com