Apr 30, 2002 Somerset, NJ
Multilink Technology Corporation (Nasdaq: MLTC), a leading provider of advanced semiconductor-based solutions that accelerate the deployment of high-speed optical networks, today introduced the MTC5522, the industry's first high performance, small form factor 12.5 Gb/s Non-Return-to-Zero (NRZ) Modulator Driver (MDR) built for MSA specification compatibility.
The MTC5522 was designed using Multilink's Micro-Module(TM) technology and offers metro customers a low power dissipation, low jitter MDR in a small form factor (16 x 16 x 1.8 mm) Ball Grid Array (BGA) package that operates with MSA-compatible voltages. The MTC5522 allows MSA module designers to meet their size, power dissipation, performance and volume manufacturability requirements for MSA modules.
The MTC5522 is a precision multi-chip module for driving NRZ modulators, and includes single-ended or differential input with a single-ended sensitivity of 250mV. The module provides a high quality, single-ended output with amplitude control, precision amplitude monitoring circuitry, and eye crossing point control for improved bit error rate performance.
"Multilink is providing metro customers with an MSA-compliant solution that is easier to design-in, has lower power and ultimately is more cost-effective," said David Huff, Vice President of Marketing. "Feedback continues to come in on how our Micro-ModuleTM products are reducing component footprint requirements by up to 70 percent. This type of overwhelming response confirms the significance of reduced size, with no sacrifice in performance, to MSA application design engineers."
The MDR provides a series of features critical to metro designers, including: low power dissipation (2.3 W typical), digital limiting amplifier function to ensure high quality and very repeatable output signal characteristics (even with less than optimal input signals), fast rise/fall times, low output jitter (10 psPP typical), high voltage drive capability, high input sensitivity, and low rail ripple. Furthermore, the MTC5522 amplitude control feature is specially designed to provide consistent output signal shape and crossing point over the full range of control. These features allow module designers high performance results with extended reach and reliability.
Micro-Module(TM) technology, which was used in the development of the MTC5522 and the MTC5529, allows Multilink to incorporate several highly sophisticated integrated circuits into an easy-to-install BGA package. Micro-Module(TM) technology combines Multilink's leading-edge product packaging with its benchmark mixed-signal and microwave technologies, to create highly reliable, superior components that match board characteristics and efficiently manage heat dissipation. Multilink's Micro-Module(TM) technology platform will be used in next-generation multi-chip products that improve transmission system performance, reduce size and decrease costs.
MTC5522 Price and Availability:
MTC5522 product samples are available today and priced at $700 in volume quantities of five thousand.
About Multilink:
Multilink Technology Corporation designs, develops and markets advanced-mixed-signal integrated circuits, modules, VLSI products and higher-level assemblies designed to enable the next generation of high-speed optical networking systems. By providing our customers with sophisticated products developed by utilizing systems level expertise and a high level of component integration, we facilitate our customers' ability to meet their time-to-market requirements. Our products span the markets from Metro to Ultra Long Haul optical transport equipment with a focus on the fastest commercially available speeds of 10 Gb/s and higher. Multilink is headquartered in Somerset, New Jersey with additional offices located throughout North America and Europe.
Safe Harbor Statement:
This release may contain forward-looking statements that are based on our current expectations, estimates and projections about our industry, and reflect management's beliefs and certain assumptions made by us based upon information available to us at this time. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will" and variations of these words or similar expressions are intended to identify forward-looking statements. In addition, any statements that refer to expectations, projections or other characterizations of future events or circumstances, including any underlying assumptions, are forward-looking statements. These statements speak only as of the date hereof. Such information is subject to change, and we will not necessarily inform you of such changes. These statements are not guarantees of future performance and are subject to risks, uncertainties and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in any forward-looking statements as a result of various factors.
Our recent annual report on Form 10-K, our Registration Statement on Form S-1 and our other SEC filings discuss some of the important risk factors that may affect our business, results of operations and financial condition. Multilink Technology Corporation undertakes no obligation to revise or update publicly any forward-looking statements for any reason.
Micro-Module(TM) is a trademark of Multilink Technology Corporation.
