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  • SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

Sep 18, 2018

SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.

PQ10 is made with the Sn42Bi58 alloy with a melting point of 138°C. In comparison with SnAgCu, PQ10 offers reduced peak reflow temperature, energy consumption, and warpage of PCBs and components.

PF606-P245 boasts superior continuous high-speed printability which produces great solder paste print quality as well as a wide reflow process window for excellent solderability. With a minimal flux residue gathering near the outside of the solder joint on the PCB substrate, SHENMAO’s PF606-P245 offers a significant improvement over its predecessors.

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.


SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes. For more information, please visit www.shenmao.com.

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