SMT, PCB Electronics Industry News

SHENMAO Provides Quality Solder Paste for SMT Assembly

Apr 01, 2019

SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.

Tin Lead Solder Paste

SHENMAO offers tin lead solder pastes made from high purity metal. This solder paste is produced with the strictest production and quality control resulting in reasonably priced product with a high quality guaranteed. The tin lead solder paste features high print speed of 0-120 mm/sec, excellent wettability, low void, reflow with or without nitrogen, over 8 hours of stencil life, and an extended tack time of greater than 12 hours.

Lead-Free Solder Paste

With a sub-license from Fuji Electronic Company, SHEMAO offers halide-containing and halide-free fluxes for lead-free solder alloys. This product features excellent wettability, low void, over 8 hours of stencil life, an extended tack time of greater than 12 hours, and a high print speed of 0-120 mm/sec.

Water-Soluble Solder Paste

SHEMAO has a full line of water=soluble fluxes and water soluble solder paste for SMT and IC packaging applications. The company offers halide and halide-free fluxes for tin/lead and lead-free solder alloys. Their water soluble solder paste formulas have been proven to provide an exceptional shell life, stencil life, wettability, and cleanability.

Package-on-Package Solder Paste

SHEMAO also offers package-on-package solder paste products for high density and advanced package technology. This product is ideal for PoP applications. Their formula has shown to have better wettability and solderability as well as a lower void than many other similar products on the market.

Low-Temperature Solder Paste

SHENMAO has developed high quality low-temperature solder paste for SMT devices. This solder paste has been qualified by a third party organization to be highly effective for SMT assembly. The melting point for this low temperature solder paste is 138 degrees Celcius.

Halogen-Free Solder Paste

SHENMAO’s lead-free halogen-free solder paste has been sub-licensed from Fuji Electronic Company. These halide-free fluxes for lead-free solder alloys conform to RoHS law, allowing customers to comfortably use lead-free products. The halogen-free solder paste features low void, high print speed of 0-120mm/sec, over 8 hours of stencil life, extended tack time of greater than 12 hours, and excellent wettability.


For more information, please visit www.shenmao.com. SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

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