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SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

May 30, 2020

SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

The new PF606-RT35 lead-free, low melting point solder paste is designed to provide long-term stability over a wide range of temperature conditions. It can be used to perform soldering with low peak reflow profiles in air or nitrogen atmospheres to save energy and improve yield rates.

Features include:

  • Excellent solderability

  • Suitable for Pin-in-Paste (Paste-in-Hole) process

  • ICT testability

  • High-speed printability

PCBs and components no longer need to withstand 240~250°C with the decrease in reflow temperature, thus the product designer can choose components and PCBs with low thermal stability to keep costs down. Additionally, the energy consumption is decreased along with the temperature drop of the reflow oven. However, the real benefit is related to the thermal storage ability of oven, product type, production quantity, etc.

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.

For more information, please visit www.shenmao.com.


SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

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