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New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Mar 02, 2021

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

SHENMAO’s JEP offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e. self-alignment and planar insulation, respectively. The new SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

SHENMAO offers halogen-free JEP/SJEM materials. Halogen can generate hazardous gas at high temperature and the use is restricted. SHENMAO halogen-free JEP/SJEM materials meet J-STD standard (≦1000ppm Chlorine/ ≦ 1000ppm Bromine) and IEC standard (≦900ppm Chlorine/ ≦ 900ppm Bromine/ ≦ 1500ppm Total halogens).

For more information, please visit www.shenmao.com.


SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

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