SMT, PCB Electronics Industry News

BEST SMT Boot Camp Nov 29-Dec 1, 2016 Featuring Phil Zarrow

Oct 25, 2016

Introduction

  • Introduction and overview of the SMT assembly process.
  • RoHS

PCB Board Fab

  • How boards fabbed
  • Surface finishes
  • Laminates
  • Flex

Solder paste

  • Basics of  the soldering process including alloys, fluxes, solder paste, rheology and intermetallic bond.  
  • Analysis of the stencil printing process including using Gerber data to manufacture stencils, different stencil considerations, squeegee selection and considerations, etc.  Paste deposition will be discussed along with common defects found during the stenciling process and the best resolution. 

Stencil design

  • Chem-etch, laser cut, e-form
  • Aperture designs
  • IPC-7525 stencil design guidelines

Printing parameters

  • Squeegee speed and pressure plus other important parameters
  • Under stencil wiping-wet and dry
  • Solder paste inspection
  • Defects typically associated with the printing process

Component Placement

  • Analysis of component placement process, machine types, where typical defects can occur and the best resolution. 
  • Machine architecture
    • Turret machines
    • Modular-all manufacturers now
    • Hybrid machines

Overview of the placement process in SMT-tour

  • Board Profiling
  • Reflow

Analysis of the reflow process and profiling. 

  • How to build a robust SMT profile, typical defects and the best resolution. 
  • Straight ramp vs ramp/soak/spike
  • Impact of cooling cycle
  • Effects of N2
  • Defects causes by improper profile

Wave Soldering

  • Analysis of the wave solder and selective solder process including profile generation, flux application and defect recognition/root cause analysis.  Hands on at the wave solder machine.
  • Flux application-spray, foam, drop jet
  • Effects of N2
  • Defects at the wave

Cleaning and cleanliness testing

  • Why Clean
  • Cleaning Chemistries
  • Manual Cleaning
  • Cleaning Equipment – Automated Cleaning
    • Vapor Degreaser
    • Aqueous/Semi Aqueous-Batch and In-Line
  • Cleanliness testing

Testing

  • Overview of the test process including AOI, AXI, ICT, flying probe and functional.

Day 3-

  • Component ID
  • PCB board fab process and tour
  • Stencil fab process
  • Stencil fab tour
  • Printing demonstration
  • Solder paste printing and placement demo
  • X-ray equipment demo
  • Tour of testing facility ICT and flying probe

Testing and certification

Aug 17, 2018 -

New Product Launched Component ID Poster for Electronics Training

Jun 15, 2018 -

Capabilities Video Launched

Mar 20, 2018 -

BEST Announces Availability of Custom Electronics Packaging

Nov 25, 2017 -

FREE IPC-A-610 and J-STD-001

Oct 03, 2017 -

New Sustainable J-STD-001 Soldering Kit

Oct 03, 2017 -

New Sustainable J-STD-001 Soldering Kit

Mar 31, 2017 -

BEST Inc. Puts Semi-Automated Mass PCB Rework Process Online

Sep 01, 2016 -

New Hands On Class for Wire/Cable Assembly

May 25, 2016 -

BEST Releases 2nd Half Training Schedule for 2016

Apr 20, 2016 -

Award for New Product Innovation Announced

22 more news from BEST Inc. »

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VJ Electronix makes component counting more accurate – Visit us at SMTA International

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Specialty Coating Systems Introduces New PrecisionCoat Automatic Quick Change at SMTAI

Sep 19, 2018 -

STI Sponsors SMTA International

Sep 19, 2018 -

Nordson Test & Inspection Announces AOI and X-ray Lineup for SMTAI

Sep 19, 2018 -

SMTA Welcomes New Board Members

Sep 19, 2018 -

Free Annual SMTA Women’s Leadership Program at SMTAI

Sep 19, 2018 -

CyberOptics to Present Technical Paper ‘Extending 3D MRS Technology to Address Challenging Measurement and Inspection Applications’

Sep 19, 2018 -

IPC Hand Soldering Competition Returns to What’s New in Electronics Live 2018

Sep 19, 2018 -

BTU to Demo New WINCON Oven Control System Release at SMTAI

Sep 18, 2018 -

Lower production costs with solder recovery from EVS – Learn more at SMTAI

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