Oct 21, 2011 Ravi Parthasarathy, Senior Process Engineer at ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, will present “Is Cleaning Critical to PoP Assemblies?” at the SMTA Penang held at the Eastin Hotel, Penang, Malaysia, on October 28th, 2011.
Package on package (PoP) assemblies are widely growing in use for applications that require small footprint technology. Typically, this integrated circuit design stacks and integrates logic and memory packages, thereby increasing board density and substantially expanding functionality within the same footprint of a single BGA. As a result, PoP’s have become an ideal component selection for products such as advanced mobile platforms and digital cameras.
Cleaning is a critical process within the electronics manufacturing industry. Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This paper will address the cleanliness level of PoP assemblies including underneath PoP components and in between packages. Expected results will empirically confirm the effectiveness of cleaning technologies for this rapidly evolving technology.
For more information on this topic, please join Mr. Ravi Parthasarathy at the SMTA Penang, contact ZESTRON’s Application Technology Department at (703) 393-9880 or visit www.zestron.com. To register for the SMTA Penang, please visit http://smtapenang.com.my/news/index.php#SMTAVendorShow.
Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. For over 20 years, ZESTRON has created products to help its customers achieve success. Today, with the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements.
