May 09, 2017 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will host “Defluxing Advanced Packages” on Thursday, May 18th, from 1:30 PM to 2:30 PM EDT. This is the third installment of the ZESTRON Academy 2017 Cleaning Webinar Series, and will be presented by Senior Application Engineer, Ravi Parthasarathy, M.S.Ch.E.
In order to increase power module yield and reliability, companies are working on new products for power packaging especially for the common failure locations, die and substrate attach, interconnection and encapsulation. This has resulted in increased performance requirement involving greater packaging density and various material mix. This webinar provides an overview of potential failures that one can expect by selecting an inappropriate chemistry and important factors that needs to be considered while selecting an optimum cleaning agent.
“We invite both new and experienced industry members to attend this free session as we’ll review how newly improved chemical formulations provide superior material compatibility and cleanliness ensuring high reliability for advanced packages,” said Sal Sparacino, Sales and Marketing Manager, ZESTRON Americas.
For more information or to register for this free webinar, visit here.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With seven worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
