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Seica, Inc. participation at SMTA International Live Virtual Exposition: September 28 - 30, 2020

Sep 06, 2020

Seica, Inc., the North American subsidiary of Seica S.p.A., will be exhibiting at the SMTA International, Live Virtual Exposition to be held on September 28 – 30, 2020. This will be a virtual event managed by https://smta.org/mpage/smtai. Attendees can register at this event at the URL listed above and navigate to the Seica, Inc. booth where they will be able to interact with our dedicated team of sales personnel and application engineers.

The “standard one of a kind” concept, made possible by the maximum versatility and configurability of all of the Next Series, allows Seica the possibility to offer solutions for different industrial automation scenarios such as in; Robotic process automation or in Distributed test.

Robotic process automation (RPA) is a growing trend in electronic board manufacturing, and the Compact RT, a dual-fixture rotary table that is designed to provide maximum productivity, optimized test throughput, and its minimal, modular design provides maximum versatility for deployment in different automated handling environments (robot/cobot) and layouts. Configurable for in-circuit, pre-functional, functional and combinational testing as well as on-board programming, this solution has the modularity needed to provide tailor-made test performance for the specific requirement with all of the advantages of a standard platform.

Distributed test in an automated line is an approach that allows to reduce time and optimize system performance and accuracy. Seica solutions includes Seica Automation handlers linking, for example, Seica Pilot V8 Next flying probe tester and Compact SL. The Compact SL being an ‘in line’ version or the Compact RT.

The Pilot V8 is the most extensive flying probe test platform on the market, with up to 20 mobile resources. The standard test probes can each apply up to a current of 2A and the system can be configured with high-resolution cameras for automatic optical inspection, barcode and data matrix reading, laser sensors, capacitive probes, pyrometers, optical fiber sensors for LEDs, mini-fixtures for boundary scan and On Board Programming. Shown in its fully-automated version, compatible with any standard assembly line, the Pilot V8 Next is engineered for medium/high volume production, and can be configured to satisfy the full range of different board test requirements. Other available features include the HR option, which extends the performance to probing of extremely miniaturized devices (down to 30 µm), and the HF option with high-frequency probes, able to measure signals at frequencies over 1.5 GHz. The Pilot V8 XL version expands the standard work area of 610 x 540 mm to 800 x 650 mm, to accommodate and test “extra-large” boards.

The Compact SL is fully automated and, like all of the Seica Next Series Compact line, it is completely configurable for in-circuit, pre-functional, functional and combinational testing, as well as on-board programming. The system architecture conforms to the World Class Manufacturing standard, and is the practical demonstration of how the Seica Compact line integrates the concepts of lean production, maintaining a small footprint without sacrificing performance.

All of the Seica solutions include the Seica’s VIVA NEXT software platform, which is able to provide intelligent integration with all aspects of the customer’s manufacturing processes - data collection, traceability, interaction with MES, repair operations – and all of the Next> series systems have Canavisia’s Industrial Monitoring solution on board, for remote monitoring of current and voltage consumption, facility power supply, temperature, light indicators and other parameters useful to indicate correct operation, provide information for predictive maintenance and, in general, to render the systems compatible with today’s Industry 4.0 standards.

For those interested in flexible “flex” cable production and test we will also present our Rapid H4 Flex line which will show flexible circuits on a spool being transported into the test area, probed, then exiting. Testing in this way, we are not talking about number of units per hour, but in regards to flexible circuits, 1000’s of feet tested per spool.

Our Firefly Next series selective solder system will also be on display “virtually” and will show very precise and accurate soldering of PCBs. The advantages of laser based soldering is for very accurate soldering scenarios where customers demand traceability of each joint soldered, where over stressing adjacent components is a concern using traditional solder methods, where solder bridging has been a concern, and where high reliability and consistency is demanded, to name a few. Our laser based solutions come with built in AOI capability where the solder joints are inspected, essentially, at the same time in the process.

Once in the booth you will be able to see and experience our Pilot V8 Next flying prober. With high resolution, RF, functional test, and traditional in-circuit test capabilities this is most innovative test tool on the market today testing semiconductor probe cards requiring some of the most demanding test requirements. MANUFACTURING, REPAIR, REVERSE ENGINEERING, PROTOTYPING and NEW PRODUCT INTRODUCTION (NPI), are also typically the environments where PILOT NEXT>Series are implemented. The Seica VIP platform software, VIVA NEXT> series, common to all of the PILOT NEXT>Series systems, allows a completely versatile test approach, from simple ICT to functional tests, from automatic, net-oriented tests to the reconstruction of the data and electrical schematics of boards coming from the field.


www.seica.com

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